IC Package Mechanical FEA Engineer (R&D)
$108k - $172.8kBroadcom
Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc.. RESPONSIBILITIES:Design responsibility for mechanical design aspects of ASIC packagesUse advanced FEA to quantify and optimize reliability and manufacturingMeasure and experiment to validate understanding and improve model accuracyCollaborate closely with package designers, reliability and manufacturing partners (internal and external) Schedule, prioritize, & track your work across 4+ projects simultaneouslyCreate presentations for and present to various audiences : engineers, managers, senior management, customers, and vendorsDocument design rules and guidelines EDUCATION/EXPERIENCE & REQUIREMENTS:Bachelors in Mechanical Engineering or similar field and 8+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 6+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 3+ years of experience in FEA modeling.Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions Ability to calibrate modeling and results with existing empirical data Perform mechanical testing and measurementDevise lab scale tests to validate analysesSeek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectationsAnsys Classic/Mechanical experience is preferred. Equivalent tool is OKCooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designersSelf-management and organization skillsPresentation and technical documentation skillsAdditional Job Description:Compensation and BenefitsThe annual base salary range for this position is $108,000 - $172,800. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.SummaryLocation: USA-Colorado-Fort Collins-4380 Ziegler Road; USA-CA San Jose Innovation DriveType: Full time
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...integrated circuits, packaging, printed circuit... ...of sales back into R&D. Our expert teams of physicists, engineers, data scientists and... ...worldwide semiconductor IC manufacturers. The... ...seeking a skilled Mechanical Design Engineer to... ...element analysis (FEA).Apply geometric...Minimum wageFull timeWork experience placementWorldwideFlexible hours$20 - $47 per hour
...circuit design, advanced packaging, systems architecture and applications engineering. We are committed to... ...required to package bumped IC to adhere to customer... ...:**• Student in Mechanical / Thermal Engineering•... ...• Working knowledge of FEA tools (ANSYS/Icepak / Flotherm...Hourly payInternship$167.3k - $284.4k
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...LinkedIn and X.We are seeking an experienced Packaging Engineer to lead the development and production... ...-level and system-level thermal and mechanical simulation for package design... ...flip-chip bumping.Strong knowledge in IC package reliability standards and requirements...Permanent employmentFull timeWork experience placementFor subcontractorWork at officeOverseasDay shiftAfternoon shift$167.3k - $284.4k
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...wafers, reticles, advanced packaging, process equipment and... ...specialty processes, IC substrates, and PCB... ...customers from early R&D through high-volume production... ...expertise. The Sr. Mechanical Design Engineer is responsible for... ..., vibrational, and FEA modeling...Minimum wageWork experience placement$141.3k - $240.2k
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...philosophy extends beyond the product to its packaging, where every detail is thoughtfully... ...~ BS degree with an emphasis in Mechanical Engineering, Packaging Science or related industry... ...Knowledge of material science and FEA Knowledge of fiber‑based materials...Relocation
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