Lead Packaging Substrate Engineer Roadmap & Innovation
Apple Oakbrook
A leading technology company in San Francisco is seeking a senior professional to lead SoC package substrate technology development. The ideal candidate will have over 10 years of relevant experience and in-depth knowledge of substrate technology. Responsibilities include collaborating with industry partners and problem-solving throughout the product development cycle. This position offers competitive compensation, stock options, and comprehensive benefits. #J-18808-Ljbffr
Vacancy posted 12 hours ago
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