CAD and Integration Engineer, Silicon

CAD and Integration Engineer, Silicon

Sunnyvale, CA

Full-Time

Detailed Job Description

We are looking for a CAD and Integration Engineer to join our custom silicon team. Working in close partnership with circuit designers, digital designers and layout engineers, you will translate circuit intent into physical constraints, drive synthesis, place-and-route, and signoff, and bridge the gap between schematic and silicon. You will also play a key role in enabling 3D stacking flows between heterogeneous process nodes. Beyond implementation, we expect a builder's mindset: developing automation tools, improving CAD flows, and actively leveraging AI-assisted design to increase team-wide engineering velocity.

CAD and Integration Engineer, Silicon Responsibilities

Integrate AI/LLM tools into workflows to drive design automation and engineering productivity

Lead analog mixed signal physical integration and enforce design constraints in collaboration with design and layout teams

Manage end-to-end digital implementation flows (RTL-to-GDS), including synthesis, PNR, DFT insertion, and signoff

Drive physical signoff (timing, power, verification) to ensure foundry-ready deliverables

Develop 3D stacking flows for heterogeneous integration and die-to-die interface planning, cross-die timing and power analysis

Automate implementation, tapeout, and regression using Python, SKILL, and Tcl

Minimum Qualifications

Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience

BS/MS/PhD in EE, CE, or a related field with 12+ years of industry experience

Proven industry experience in analog CAD/automation support areas involving various technology nodes and tapeouts

Expertise in full RTL-to-GDS flow, digital synthesis, PNR, and physical signoff

Proficiency in analog mixed signal design environment and simulation tools

Knowledge of PDK and Spice model qualification

Strong programming skills in languages such as SKILL, Python, Perl etc. to provide automation needs

Hands-on experience with AI coding assistants

Experience communicating technical decisions and project status to cross-functional partners, including circuit designers, layout engineers, and foundry contacts

Preferred Qualifications

Familiarity with advanced packaging technologies and their implications for chip-level CAD methodology and integration flows

Experience with hierarchical chip integration and assembly flows for large, multi-block SoCs targeting consumer electronics or wearable device applications

Experience with low-power design methodologies including multi-voltage domain integration, UPF-based power intent, and power analysis sign-off for mobile or wearable silicon

Experience engaging directly with foundry partners on process design kit development, design rule updates, and technology qualification for leading-edge nodes