Senior Manager, Power Package Design & NPI
Renesas Electronics Corporation
Renesas Electronics in Tempe, AZ seeks a senior packaging leader to drive technology development and NPI for power SiP and interconnect solutions. You will coordinate with OSATs, subcontractors, and cross-functional teams to ensure on-time qualification and robust production transfer. You will oversee SiC/GaN packaging activities and advanced substrates, while guiding DOE plans, risk assessments, and delivery against targets. A strong track record in power packaging is required. #J-18808-Ljbffr Renesas Electronics Corporation
Vacancy posted 3 days ago
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