Equipment Engineer, Texas Institute for Electronics

Equipment EngineerThe Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.With over $1 billion in funding from the US DoD and the state of Texas, we're at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named "America's Coolest City" by Expedia and "The Best Place to Live in the U.S." by U.S. News and World Report — the Texas Institute for Electronics embodies the city's innovative spirit.UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)Voluntary Vision, Dental, Life, and Disability insurance optionsGenerous paid vacation, sick time, and holidaysTeachers Retirement System of Texas, a defined benefit retirement plan, with employer matching fundsAdditional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)Flexible spending account options for medical and childcare expensesRobust free training access through LinkedIn Learning plus professional conference opportunitiesTuition assistanceExpansive employee discount program including athletic ticketsFree access to UT Austin's libraries and museums with staff ID cardFree rides on all UT Shuttle and Austin CapMetro buses with staff ID cardFor more details, please see: Benefits | Human Resources and UT Austin Employee Experience | Human ResourcesThis position's primary function is to ensure the overall equipment effectiveness of semiconductor and packaging process equipment in our fabs. We are filling positions for equipment engineers in these functional equipment areas: lithography, high-vacuum plasma, wet processing, mechanical processing, and metrology and inspection. Equipment engineers will be responsible for equipment installation, the creation of equipment maintenance procedures and schedules, parts-and-kit selection-or-creation. Equipment engineers will work closely with process tool owners and integration engineers to ensure we are driving fast cycles of learning in semiconductor advanced packaging.Each equipment engineer will be responsible for one of these functional groups of equipment. TIE is filling one position per functional area.Lithography: Coat tracks, Steppers, Litho-specific metrologyHigh-Vacuum Plasma: CVD, Etch, Plasma Dicing, PVDWet Processing: Batch cleaning, single wafer cleaning, plating.Mechanical Processes: CMP, Grinding, Dicing, Bonding.Metrology and Inspection: SEM, Defect Inspection, Film Thickness, MicroscopesManage the installation of equipment as follows:Drive and approve installation packagesManage MEP schedule and installationEnsure safety complianceManaging acquisition and installation of pedestals, VMBs, LDS, process piping, exhaust, drains andOversee subcontractors.Create and maintain the following for the equipment in your functional area:Equipment SpecificationsSPC Charts, including reacting to trendsTechnician Training PlansMaintenance Checklists and SchedulesProcess KitsEquipment Dashboards, and OEE Analysis ReportsParticipate in or Drive Tool Selections, Equipment Procurement, Upgrade Planning, Parts Management.Perform other related functions as assigned.Bachelor's degree in an engineering discipline, such as electrical, chemical, or mechanical, or similar related technical field.Three years of engineering experience in a semiconductor fab or semiconductor advanced packaging facility.Equipment Installation Project ManagementStatistical Process Control experienceMust have the ability to work independently and have excellent interpersonal communication and written skills.Dependable, stable under pressure and can easily adapt to change.Relevant education and experience may be substituted as appropriate.Five or more years of Semiconductor Equipment EngineeringMaster's Degree or higherJob duties may be performed in a clean room environment, in awkward positions and/ or in high places. Mechanical aptitude, manual dexterity and ability to lift/carry objects up to 35 pounds may be required.May require bending/stooping/crawling/climbing and use of PPE.May work around chemical fumesMay work around biohazardsMay work around chemicalsMay work around electrical and mechanical hazardsMay be required to work in confined spaces, tunnels, on elevated platformsResume/CV3 work references with their contact information; at least one reference should be from a supervisorLetter of Interest