Senior 3D Packaging Architect for AI Accelerators
Jobleads-US
Entrada Ventures, a Silicon Valley–based startup, seeks a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators. You will drive package architecture, substrate design, manufacturability, and vendor engagement in a fast-paced environment.
You will partner with IC design, physical design, and board teams to meet system-level needs, evaluate new packaging technologies, and support bring-up and qualification across internal sites and
#J-18808-Ljbffr Jobleads-USVacancy posted 4 days ago
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