Silicon Packaging Design Engineer: Substrate Innovator

Intel Corporation

Intel is seeking a Silicon Packaging Design Engineer in Phoenix to drive end-to-end substrate design from concept to tape-out, ensuring performance, cost efficiency, and manufacturability. You will work with silicon and hardware teams to deliver cutting-edge, high-performance solutions. The role involves layout, routing, design rule development, and cross-functional collaboration to optimize pinout and silicon-package-board interactions. On-site presence is required in Arizona. #J-18808-Ljbffr Intel Corporation

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Vacancy posted 4 days ago

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