Substrate IC Design Engineer

Strong Salary + Company Equity + Benefits Permanent My client is changing the landscape of semiconductor manufacturing! This is a high-impact role where you'll play a key part in developing cutting-edge precision manufacturing processes for next-generation micro-scale technologies This role includes shaping next-generation packaging architectures, including high-performance chip-to-chip integration solutions. Qualifications required Multiple years of experience in substrate IC package design Must have strong experience in advanced packaging architectures. Advanced proficiency in Allegro Package Designer (constraint management, routing) Strong understanding of SI/PI principles and their application to package-level design #J-18808-Ljbffr ProFound People