APTM NPI Integrator

Job Details We are seeking a highly motivated and technically skilled Integrator to lead the development and execution of new product/process introduction and process transfers across factories. The ideal candidate will play a key role in ensuring that technology, platforms, and products meet certification requirements before transferring to HVM. Responsibilities Logistical coordinator of introducing a new product into the factory by supplying the required process documentation to factory customers. Primary information interface between the fab and the upstream/downstream customers. Tracking the collateral items, communicating wafer shipping to post fab customers, creating and updating the product codes in the internal systems. Setting up lot flows, kicking off NPI Checklists for each module, starting the silicon and monitoring its progress through the process flow for set up, power-on and engineering samples until first production. Develop and implement new NPI systems and business processes as they become ready and close any issues identified in a NPI reflection. Candidate Behavioral Traits Strong understanding of a product’s life cycle, fab processing, and post fab activities. Good understanding of key product/process development milestones. Strong experience working with and managing NPI builds in a factory environment; able to drive capacity execution efficiency accordingly. Quick learner, able to track issues and drive them to closure at all levels of the organization. Excellent verbal and written communication, and presentation skills. Qualifications Minimum Qualifications: Bachelor’s Degree in Chemistry, Mechanical, Materials Science, Electrical Engineering or a related field of study with 4+ years of experience working with engineering fundamentals. OR Master’s degree in Chemistry, Mechanical, Materials Science, Electrical Engineering or a related field of study with 3+ years of experience working with engineering fundamentals. Preferred Qualifications and Skills: Process Integration: Experience in integrating packaging processes with overall product manufacturing workflows. Package Design: Experience in designing packaging solutions that meet product specifications, regulatory requirements, and customer needs. Previous related work experience in a semiconductor foundry preferred. Job Type Experienced Hire Shift Shift1 (United States of America) Primary Location US, Oregon, Hillsboro Additional Locations US, New Mexico, Albuquerque Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range $99,030.00 - 188,890.00 USD for US locations. Work Model This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change. Additional Information Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. #J-18808-Ljbffr Intel