Process Integration Engineer

At Micron, we are undergoing a historic expansion with our new fabrication facility in Boise, ID. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading‑edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry and AI. We’re building a next‑generation manufacturing capability in Boise (ID1), partnering closely with global teams to bring advanced DRAM technology into a greenfield fab. This is a highly collaborative environment where we solve complex integration challenges and directly impact yield, cost, and product quality. If you enjoy working at the intersection of device physics and manufacturing, you’ll find strong ownership and technical depth here. As a Senior Process Integration Engineer in our Advanced Technology and Engineering group, you will play a key role in transferring and scaling advanced DRAM nodes into high‑volume production. You’ll lead integration efforts across modules, drive yield ramp, and resolve complex process interactions. This role is critical to achieving production readiness and sustaining best‑in‑class performance as we launch a state‑of‑the‑art fabrication facility. Responsibilities Lead module ownership including root cause analysis and fast‑paced failure investigation Drive yield, cost, and quality improvements using data‑driven methodologies Develop and execute DOE to improve process capability, margin, and stability Lead technology transfer and yield ramp from TD or HVM fabs into Boise (ID1) Coordinate cross‑functional teams to qualify processes, tools, and materials Minimum Qualifications Bachelor’s degree in Engineering or related technical field 5+ years of semiconductor fab or HVM experience, including memory technologies 3+ years in process integration, yield ramp, or quality improvement Strong understanding of transistor operation, device scaling, and reliability Experience with DOE, data analysis, and problem‑solving methodologies Willingness to travel international for training and/or work on shift as needed Preferred Qualifications Master’s or PhD in Materials Science, Electrical Engineering, Chemical Engineering, or related field Experience in DRAM integration, TD, or yield analysis in 300mm environments Knowledge of technology transfer and high‑volume manufacturing scale‑up Experience with FMEA, 8D, SPC, or FDC methodologies Proven ability to lead cross‑functional initiatives and technical problem solving As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr