BA Senior Electronics Failure Analysis Engineer-BSEE, IC FA, RCA

Senior Electronic Failure Analysis Engineer - Semiconductor & Electronics TestiingLocation - Santa Clara / San Jose, South Bay Area, CaliforniaRelocation Assistance - Considered for highly qualified, Non local candidates who desire a move.Employment Type - Full-Time/Direct Hire/PermWork Environment - Onsite ( NO Remote/Hybrid options) Work is Laboratory basedPLEASE REACH OUT if this role is a fit for your skill-set, career goals and the time is right for a move...You can apply to this role and email me directly at View email address on click.appcast.io and I will be in touch to discuss further.A well-established independent engineering and testing organization is seeking a Senior Failure Analysis Engineer/ Electronic Failure Analysis Engineer to join its advanced electronics and semiconductor investigation team. This laboratory supports a broad range of customers across the semiconductor, electronics, aerospace, industrial, medical, and advanced technology sectors through specialized third-party testing, analysis, and engineering services.This is a highly visible, senior-level position intended for an experienced engineer with a strong electrical engineering foundation and extensive semiconductor failure analysis expertise. The role offers the opportunity to lead complex technical investigations while remaining deeply involved in hands-on laboratory work.We are seeking an individual who combines strong technical leadership capabilities with the ability to personally execute detailed analytical investigations, diagnose complex failures, and communicate findings to customers and internal stakeholders.Position SummaryThe successful candidate will lead and perform root-cause investigations involving integrated circuits, semiconductor devices, electronic assemblies, and related technologies. This individual will own projects from initial problem definition through fault isolation, physical analysis, root-cause determination, and final reporting.Key ResponsibilitiesConduct comprehensive failure analysis investigations on semiconductor devices, integrated circuits, electronic assemblies, and electromechanical products.Develop and execute analytical strategies to identify electrical, mechanical, manufacturing, and reliability-related failure mechanisms.Perform fault isolation, characterization, and root-cause investigations using advanced laboratory techniques.Analyze production test data, ATE results, schematics, electrical measurements, and device performance information.Support and lead deprocessing activities, sample preparation, package opening, and physical analysis workflows.Review analytical data and ensure the technical accuracy of engineering conclusions and reports.Prepare detailed written reports documenting findings, supporting evidence, conclusions, and recommendations.Present technical results to engineering teams, quality groups, and external customers.Recommend corrective actions and process improvements to improve reliability, yield, and product performance.tion / Required ExperienceBachelor of Science in Electrical Engineering (BSEE) required. (THIS ROLE IS ELECTRONICS FOCUSED - THIS IS NOT A MATERIAL SCIENCE/Materials testing role )Master's degree or advanced technical degree strongly preferred.Candidates should possess a strong electrical engineering foundation rather than a primary materials science focus.5-10+ years of progressive experience in semiconductor or electronics failure analysis.Demonstrated experience investigating failures involving semiconductor devices and electronic components.Strong understanding of semiconductor device operation and failure mechanisms.Experience working with or supporting semiconductor fabrication processes.Knowledge of semiconductor manufacturing, process flows, and device structures.Experience with device physics, characterization, testing, qualification, and performance analysis.Exposure to integrated circuit design, testing methodologies, and device evaluation.Familiarity with semiconductor packaging, package assembly processes, and package-related failure modes.Experience writing, reviewing, and presenting technical reports for engineering and customer audiences.Candidates should possess recent hands-on experience with several of the following techniques and technologies:Electrical & Fault Isolation TechniquesCurve tracing and electrical characterizationParametric testingOscilloscope-based diagnosticsTime Domain Reflectometry (TDR)MicroprobingLaser-assisted fault isolation techniquesLight Emission Microscopy (LEM)Infrared Microscopy (IR)Emission-based diagnostic methodsPhysical Analysis & CharacterizationScanning Electron Microscopy (SEM)Energy Dispersive Spectroscopy (EDS)Cross-sectioning and microsection analysisX-ray inspectionX-ray Fluorescence (XRF)Destructive Physical Analysis (DPA)FractographyMaterial and construction analysisSample Preparation & DeprocessingFocused Ion Beam FIB analysisDual-Beam FIB techniquesIon millingSample preparation and deprocessingPackage opening and layer removal techniquesDye-and-pry investigationsPackaging & Assembly AnalysisBond pull testingBond shear testingAcoustic microscopy - SAM, CSAMPackage integrity evaluationAdvanced package analysisProfessional QualificationsExcellent verbal and written communication skills.Ability to interact effectively with both engineering teams and external customers.Strong technical presentation and report-writing capabilities.Proven ability to manage multiple projects simultaneously while meeting aggressive deadlines.Strong organizational, planning, and prioritization skills.High attention to detail and commitment to technical accuracy.Demonstrated ability to work effectively within a collaborative team environment.Customer-focused mindset with the ability to translate complex technical findings into clear business recommendations.Preferred QualificationsExperience supporting advanced semiconductor technologies and modern device architectures.Knowledge of industry standards related to electronics reliability and qualification.Experience interfacing directly with external customers on technical projects.Exposure to automated test systems and engineering software tools.Previous project leadership, technical lead, or supervisory responsibilities.Experience managing complex, customer-driven analytical investigations.Failure Analysis Engineer, Semiconductor Failure Analysis, Root Cause Analysis, Electronics Reliability, Device Physics, IC Failure Analysis, Electrical Engineering, Fault Isolation, SEM, EDS, FIB, X-Ray, CSAM, TDR, Microelectronics, Reliability Engineering, Semiconductor Packaging, Materials Characterization, Integrated Circuits, Laboratory Engineering, Electronic Test and Analysis.Benefits? Medical, Dental and Vision Coverage? 401k Company Matching? Paid Time Off? Wellness Program? Education AssistancePLUS MANY OTHERS