Senior Silicon Packaging Architect - Advanced 3DIC
Jobleads-US
Synopsys, Inc. is seeking an experienced hardware engineering professional specializing in advanced silicon package design.
You will lead cross-functional efforts to optimize SIPI performance, including bump mapping and power estimation, and develop interposers and RDL fanout packages for high-performance silicon solutions. You will model, simulate, and validate electrical, thermal, and mechanical aspects while collaborating with global teams and customers to drive innovation in packaging
#J-18808-Ljbffr Jobleads-USVacancy posted 9 hours ago
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