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ElectroMechanical Design Engineer Sr. (Harness Design)

Lockheed Martin

Description You will be the Senior Electromechanical Design Engineer for the Missiles & Fire Control (MFC) Hardware Engineering team. Our team designs, develops and manufactures precision engagement aerospace and defense systems for the United States and allied forces, delivering cutting edge electronic packaging, prototype hardware, and production ready solutions. Location Dallas, Texas. Schedule 4x10 hour day, 3 days off per week. What You Will Be Doing Guiding hardware teams from concept through production to ensure on time, high quality delivery. Designing electromechanical systems for missile and radar electronics, including CCA/PWB packaging, harnesses, and enclosures. Creating detailed 3D models, 2D drawings, and layouts; selecting materials, components and manufacturing processes that meet size, weight, power and environmental limits. Acting as a Material Review Board (MRB) authority, making informed technical decisions and driving issue resolution. Defining acceptance test criteria, executing verification tests and documenting results for each hardware iteration. Performing thermal, shock, vibration and EMI analyses to satisfy flight qualification standards. Supporting program planning and partnering with senior management, production, quality and customers to meet cost, schedule and technical requirements. Mentoring junior engineers and fostering cross functional integration. Maintaining configuration control and design documentation in LockheedMartin PLM tools (Windchill, Creo). Contributing to technical reviews and independent research and development (IRAD) initiatives. Basic Qualifications Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master’s degree preferred. Minimum 3 years of professional experience in Electromechanical Engineering or related discipline. Experience with CREO and Windchill or equivalent CAD and PLM tools. Experience with MFC circuit card and printed wiring board packaging design. Experience with Technical Data Package generation, including BOM creation in Windchill, 2D drawings, and 3D modeling. Working knowledge of GD&T (Geometric Dimensioning and Tolerancing). Excellent communication and interpersonal skills. Experience working with defense customers. Team management experience. Must be a US Citizen; must possess or be able to obtain a DoD Secret security clearance. Desired Skills Prior knowledge of MFC programs. IRAD to LRIP transition experience. Experience working with production and quality teams. Experience with machined components, test equipment, and cable assemblies. Experience with Windchill PDM (Product Data Management). Experience with military and aerospace specifications. Ability to manage multiple assignments/programs. Experience with Microsoft Office (Excel, Word, PowerPoint) and AutoCAD. Experience designing electronics packaging for Flight Termination Systems. Knowledge of Design Assurance processes. Working knowledge of Zuken. Active DoD Secret or Top Secret Clearance. Security Clearance and Citizenship MUST BE A U.S. CITIZEN and must obtain a Secret clearance. Clearance Level: Secret. The selected candidate must be able to obtain a DoD Secret security clearance. Equal Opportunity Employer Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics. #J-18808-Ljbffr Lockheed Martin

Vacancy posted 12 hours ago
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