Sr. Field Service Engineer

About this position

Plasma-Therm is a leading provider of advanced processing equipment and solutions, specializing in semiconductor manufacturing.

Shift / Travel

Local Fab Support (Phoenix, AZ Area) with On-Call Rotation & Limited Overseas/Domestic Travel

Position Overview

The Senior Field Service Engineer IV (FSE IV) serves as a lead technical expert responsible for tool installation, startup, advanced troubleshooting, preventive maintenance, and modifications for advanced semiconductor capital equipment. In this high-visibility role supporting our Strategic OEM Partnership, the FSE IV will provide critical on-site support at a leading-edge semiconductor manufacturing facility in Arizona across both strategic partner wet processing product lines (Wet Etch / Clean platforms) and Plasma-Therm plasma processing equipment (e.g., PECVD and Dry Etch systems).

The ideal candidate brings deep technical expertise in chemical dispense delivery, wet processing mechanics, fluidics, high-purity piping, process temperature control, vacuum systems, and robotics, along with strong customer-facing leadership skills to manage complex fab escalations.

Key Responsibilities

1. Overseas OEM Training & Product Bring-Up

• Complete intensive, hands‑on factory training at the strategic partner’s manufacturing facility in Taiwan on new pre‑release wet processing/wet etch platforms.
• Work directly with factory development engineers during sub‑assembly, software configuration, and initial tool integration.
• Help capture, review, and refine initial standard operating procedures (SOPs), maintenance protocols, and commissioning checklists for field deployment.
• Lead and oversee on‑site tool uncrating, rigging supervision, facility chemical/utility hookup verification, and system power‑on for new tool deliveries in Phoenix.
• Execute pre‑commissioning checks, sensor calibrations, fluid delivery testing, and Site Acceptance Testing (SAT) to achieve fast time‑to‑first‑wafer.
• Interface directly with customer fab engineers, facility chemical engineering teams, and rigging contractors to maintain installation schedules.

3. Advanced Technical Troubleshooting & Dual-Platform Support

• Perform routine preventive maintenance (PM) and unscheduled corrective maintenance across both wet etch systems and Plasma‑Therm dry processing platforms under strict SLA guidelines (<2 hour response target).
• Lead root‑cause failure analysis for complex chemical delivery, fluidic valves, heater control, robotic wafer transfer, vacuum, and electromechanical escalations.
• Author and drive 8D Quality/Failure Reports to closure in collaboration with factory engineering teams in Taiwan and domestic headquarters.
• Serve as the primary technical point of contact during critical tool‑down scenarios, conducting daily technical updates with customer fab management.
• Ensure strict adherence to customer safety (EHS), cleanroom, chemical handling, and Lockout/Tagout (LOTO) protocols.
• Mentor and train peer engineers, supporting the development of internal SOPs and training logs.

Required Qualifications & Experience

• Education: Associate’s or Bachelor’s degree in Electrical/Mechanical Engineering, Mechatronics, Semiconductor Technology, or equivalent military technical training/experience.
• Experience: 8+ years of direct field service or equipment engineering experience in semiconductor capital equipment manufacturing or advanced wafer fabs.

Technical Skills

• Wet Processing / Wet Etch Expertise: Deep knowledge of liquid chemical delivery systems, high‑purity chemical plumbing/valves (PFA/PVDF), dosing pumps, chemical inline heating/chilling, bath recirculation, flow meters, and liquid filtration.
• Dry / Vacuum Systems: Proficiency with vacuum systems (turbomolecular & dry pumps, vacuum gauging) and electromechanical assemblies.
• Hands‑on experience reading complex electrical schematics, Piping & Instrumentation Diagrams (P&ID), fluidic schematics, and software diagnostic logs.
• Strong working knowledge of cleanroom safety protocols, hazardous chemical handling (acids, bases, solvents), chemical spill protocols, and LOTO procedures.

Soft Skills

• Exceptional written and verbal communication skills for customer escalation management.
• Strong problem‑solving mindset using structured problem‑solving methodologies (e.g., 8D, 5 Whys).
• Ability to work independently in a fast‑paced fab environment and handle high‑pressure customer situations.

Preferred Qualifications

• Prior experience with Plasma‑Therm equipment (e.g., Kobus PECVD, plasma etch, PVD, Evaporator systems).
• Prior experience working within high‑volume 300mm wafer fabrication facilities.
• Familiarity with enterprise tracking tools (e.g., Jira, Confluence, ERP platforms) for tracking service cases, tool serial numbers, and field actions.

Work Environment & Physical Requirements

• Must be able to work inside a Class 10/100 semiconductor cleanroom environment requiring full bunny suit protocol.
• Must be able to lift up to 50 lbs, bend, stoop, and stand for extended periods.
• Flexibility to work varied shifts, including weekend coverage or emergency on‑call rotations as customer demand dictates.