Strategic Student Program: Cross-Domain Manufacturing Systems Engineering Intern (T&I, Spring 2027)

• Minimum 3.0 GPA

Siemens Industry Software Inc.

Strategic Student Program (SSP)

Discover your career with us at Siemens Industry Software!

We are a leading global software company dedicated to the world of computer aided design, 3D modeling and simulation— helping innovative global manufacturers design better products, faster! With the resources of a large company, and the energy of a software start-up, we have fun together while creating a world class software portfolio. Our culture encourages creativity, welcomes fresh thinking and focuses on growth, so our people, our business, and our customers can achieve their full potential.

We’re currently recruiting students for our {1st or 2nd semester of Senior year, or graduate level} Strategic Student Program. Our intern positions will allow you to find a career path that most inspires you. Here, you will apply your education to solve real-world problems, and turn theory into practice. At Siemens, our goal is to empower our students to become the next leaders of our company.

Baseline Requirements:

• Currently enrolled as a university {Senior, Master’s or PhD candidate} student
• Minimum 3.0 GPA
• Authorized to work in the United States without the need for current or future sponsorship by the company
• Graduating 2028, or later
• Detroit, MI; Wilsonville, OR; possible remote depending on degree level being pursued

Perks:

• Paid volunteer time off
• Employee discounts at our top customer sites
• Networking with our global leaders
• Mentorship from senior engineers
• Individual career development planning
• Professional and technical workshops
• Energetic student community
• Leadership opportunities
• Potential for full time offers after university graduation and completion of the program

Cross-Domain EDA/CAE/Manufacturing Systems Engineering Intern

About The Team

The Cross Product Solution Management (CPSM) team researches and develops innovative solutions that demonstrate how modern engineering disciplines work together across Product Lifecycle Management (PLM), robotics, mechatronics, semiconductor manufacturing, electronics, AI, and software engineering. This internship offers the opportunity to contribute to a "silicon-to-rack" engineering initiative that showcases the integration of EDA, PLM, and AI-enabled workflows across the entire product development lifecycle.

What You’ll Do

• Research and evaluate emerging semiconductor engineering technologies (3D IC) and workflows
• Develop software prototypes, automation tools, and proof-of-concept solutions
• Semiconductor, PCB, and system-level design, validation, and implementation concepts
• Document technical findings through white papers, tutorials, and technical guides
• Investigate AI‑assisted engineering and documentation workflows
• Learn and utilize industry‑leading EDA and PLM tools
• Help define and demonstrate an end‑to‑end engineering digital thread from silicon design through system deployment

Areas of Exposure

• Semiconductor and IC design and CAE methodologies
• 3D-IC and advanced packaging concepts
• Mechanical design integration
• Product Lifecycle Management (PLM)
• Technical documentation and workflow development
• Packaging and manufacturing concepts

Required Qualifications

• Pursuing a Bachelor’s, Masters, or Ph.D. degree in Mechanical Engineering, Electrical or Electronics Engineering, or related STEM field
• Strong analytical and problem‑solving skills
• Excellent verbal and written communication skills
• Ability to learn quickly and work independently
• Self‑motivated, curious, and adaptable

Preferred Qualifications

• Semiconductor packaging design and implementation research emphasis or exposure
• Interest in CAE, EDA, PLM, automation, or AI technologies
• Familiarity with Linux or scripting environments
• Previous internship, co‑op, or project experience a plus

Position Objective

Contribute to the research, development, and documentation of a reference "silicon-to-rack" product development workflow demonstrating how modern CAE, EDA, PLM, and AI technologies connect semiconductor design and packaging, system design, mechanical engineering, and lifecycle management into a unified engineering ecosystem. The initiative spans IC design, packaging, PCB, mechanical, and PLM domains within an integrated engineering workflow.

The hourly range for this position is $18.00 to $50.00. Siemens offers a variety of health and wellness benefits to employees. The actual compensation offered is based on the successful candidate’s work location, as well as degree type and relevant education. Details regarding our benefits can be found here: In addition, this position is eligible for time off in accordance with Company policies, including paid sick leave and paid volunteer time off.

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