Process Development Engineer (Dry Etch)

TITLE: DRY ETCH PROCESS DEVELOPMENT ENGINEER (Reader)

FLSA STATUS: EXEMPT

REPORTS TO: DIRECTOR, DRY ETCH PROCESS ENGINEERING

SUMMARY:

Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer (Reader) is responsible for the developing and implementing new RIE, IBD, and Ashing processes for next generation magnetic recording heads, including implementing new process control schemes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; research, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

Develops and implements new dry etch processes (RIE, IBE, and Ashing) for next generation magnetic recording heads Implements new process control schemes or methodologies which ensure product manufacturability Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap Adheres to appropriate timeline for introducing new processes into the manufacturing line Reviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action Partners with other groups and departments, including process and product engineering to develop and deliver products and programs Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition Partners with Equipment Engineering to research, select, and qualify new RIE tools Adheres to all safety policies and procedures as required Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:

Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master’s degree preferred Three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process Engineer Experience in plasma etch process development (RIE, IBE, Ashing, etc.) is preferred Experience working in a wafer fab manufacturing environment Experience with Statistical Process Control (SPC) Proficient in the use of Microsoft Office Applications Knowledge, Skills, and Abilities: Knowledge of semiconductor or HDD industry principles, practices, and techniques Knowledge of wafer fabrication processing techniques, including process development and integration practices Knowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniques Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure Knowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate action Knowledge and ability to use Microsoft Office applications to create reports and presentations Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management Able to work productively and collaboratively with all levels of employees and management Able to comply with all safety policies and procedures Demonstrated organizational and time management skills Demonstrated problem-solving and trouble shooting skills Flexible and able to prioritize The annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Dry Etch Process Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds. *Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting. TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department. #J-18808-Ljbffr Headway Technologies