USA|USD| Eng - Process Engineer - Intermediate
Artech
Position Details:
Job title: Eng - Process Engineer
Duration: 12 -month contract
Work Location: Santa Clara, CA
Pay rate:$44.44 - $53.33/hr. on W2.
Job ID: #26-18903
Experience: 1-2 Years
Key Responsibilities
• Design, collect data, analyze and compile reports on process engineering experiments for defect reduction, within safety guidelines
• Troubleshoot defect problems, perform Root Cause Analysis and resolve moderately difficult process engineering issues
• Implement new technology, products and analytical instrumentation to support the defect study
• Design the failure analysis (FA) DOE for the key defect critical components to troubleshoot the wafer defect issue on the key R&D programs and major customer escalations
• Perform the FA, collect and analyze the data within safety guidelines
• Communicate the FA observation and recommend the solution path in defect troubleshooting
• Measure the wafer defect/film properties, organize data/reports for review in supporting the defectivity improvement by SEM/FIB
• Prepare wafers for experimentation, include cleaning, loading wafers. Prepare klarf files. Evaluate and recommend performance of process system.
• Operate scanning electron microscope (SEM) for top view or critical dimension and energy dispersive spectroscopy (EDS) analysis / imaging pending on job assignment, identify all of patterns of interest, understand image quality requirement and sample/beam interaction to determine optimized condition.
• Prepare samples for Focused Ion Beam (FIB) lamella making by utilizing Zeta Marking tool and optimize sample prep procedure and conditions, identify cutting location based on pattern instructions.
• Operate and check performance of equipment to perform sample prep process, under limited supervision
• Understand the Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) principle.
• Operate Focused Ion Beam (FIB) for making TEM lamella pending on job assignment, identify all of patterns of interest, understand lamella quality requirement and sample/beam interaction to determine optimized conditions.
• Perform SEM/FIB system software alignment functions. Perform routine maintenance procedures, flash, plasma clean etc.
• Perform routine shut down procedure. Identify problem put tool down and call for service.
• Coordinates instrument repair and maintenance. Coordinates with engineering on wafer evaluations.
• Orders equipment and supplies, and coordinates with vendors and purchasing.
• Orders equipment and supplies, and coordinates with vendors and purchasing.
• Coordinates with engineering on wafer evaluations. Sets up equipment for experiments.
• Perform routine shut down procedure. Identify problem put tool down and call for service.
• Report and communicate the wafer defect analysis result, recommend the solution path for wafer defect troubleshooting on key R&D programs
• Interact with vendors/suppliers to evaluate/troubleshoot the latest defect metrology tools (SEM, EDX, FIB, Wafer scribing)
• Develop and publish best known method (BKM) procedures including, sample prep, scanning electron microscope (SEM) conditions, and special sample handling.
• Generate internal documentation for products, presentations and technical reports
• Provide trainings for junior engineers for wafer preparation/analysis on defect metrology tools
• Contribute and manage the Metrology tool (Zeta/SEMVision) operation
• Interface with requestors, understand their detail requirement, and communicate on results;
• Help lab on monitoring wafer in process (WIP) and maintaining quality, turnaround time, and throughput.
• Define and forecast the defect metrology tool requirement to support N+ defect requirement
• Host the defect knowledge sharing forum, internal workshop/conference
Regards,
Lekhana Yathiraj
Senior Technical Recruiter
Office: View phone number on click.appcast.io
Artech Information Systems LLC
360 Mt. Kemble Avenue., Suite 2000, Morristown, NJ 07960
Email: View email address on click.appcast.io , Website:
Job title: Eng - Process Engineer
Duration: 12 -month contract
Work Location: Santa Clara, CA
Pay rate:$44.44 - $53.33/hr. on W2.
Job ID: #26-18903
Experience: 1-2 Years
Key Responsibilities
• Design, collect data, analyze and compile reports on process engineering experiments for defect reduction, within safety guidelines
• Troubleshoot defect problems, perform Root Cause Analysis and resolve moderately difficult process engineering issues
• Implement new technology, products and analytical instrumentation to support the defect study
• Design the failure analysis (FA) DOE for the key defect critical components to troubleshoot the wafer defect issue on the key R&D programs and major customer escalations
• Perform the FA, collect and analyze the data within safety guidelines
• Communicate the FA observation and recommend the solution path in defect troubleshooting
• Measure the wafer defect/film properties, organize data/reports for review in supporting the defectivity improvement by SEM/FIB
• Prepare wafers for experimentation, include cleaning, loading wafers. Prepare klarf files. Evaluate and recommend performance of process system.
• Operate scanning electron microscope (SEM) for top view or critical dimension and energy dispersive spectroscopy (EDS) analysis / imaging pending on job assignment, identify all of patterns of interest, understand image quality requirement and sample/beam interaction to determine optimized condition.
• Prepare samples for Focused Ion Beam (FIB) lamella making by utilizing Zeta Marking tool and optimize sample prep procedure and conditions, identify cutting location based on pattern instructions.
• Operate and check performance of equipment to perform sample prep process, under limited supervision
• Understand the Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) principle.
• Operate Focused Ion Beam (FIB) for making TEM lamella pending on job assignment, identify all of patterns of interest, understand lamella quality requirement and sample/beam interaction to determine optimized conditions.
• Perform SEM/FIB system software alignment functions. Perform routine maintenance procedures, flash, plasma clean etc.
• Perform routine shut down procedure. Identify problem put tool down and call for service.
• Coordinates instrument repair and maintenance. Coordinates with engineering on wafer evaluations.
• Orders equipment and supplies, and coordinates with vendors and purchasing.
• Orders equipment and supplies, and coordinates with vendors and purchasing.
• Coordinates with engineering on wafer evaluations. Sets up equipment for experiments.
• Perform routine shut down procedure. Identify problem put tool down and call for service.
• Report and communicate the wafer defect analysis result, recommend the solution path for wafer defect troubleshooting on key R&D programs
• Interact with vendors/suppliers to evaluate/troubleshoot the latest defect metrology tools (SEM, EDX, FIB, Wafer scribing)
• Develop and publish best known method (BKM) procedures including, sample prep, scanning electron microscope (SEM) conditions, and special sample handling.
• Generate internal documentation for products, presentations and technical reports
• Provide trainings for junior engineers for wafer preparation/analysis on defect metrology tools
• Contribute and manage the Metrology tool (Zeta/SEMVision) operation
• Interface with requestors, understand their detail requirement, and communicate on results;
• Help lab on monitoring wafer in process (WIP) and maintaining quality, turnaround time, and throughput.
• Define and forecast the defect metrology tool requirement to support N+ defect requirement
• Host the defect knowledge sharing forum, internal workshop/conference
Regards,
Lekhana Yathiraj
Senior Technical Recruiter
Office: View phone number on click.appcast.io
Artech Information Systems LLC
360 Mt. Kemble Avenue., Suite 2000, Morristown, NJ 07960
Email: View email address on click.appcast.io , Website:
Vacancy posted 1 day ago
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