IC Packaging Design Engineer

Summary

Tessolve is hiring 4 IC Packaging Design Engineers based in Chandler, AZ (primary) or Hillsboro, OR (secondary). We're looking for senior-level talent (10+ years) primarily, with mid-level (4–6+ years MS / 6+ years BS) candidates also considered.

About the Role

As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.

What You'll Do

• Perform physical design and layout of IC packages
• Execute substrate design and layout
• Implement SI/PI-aware design practices
• Design for performance, manufacturability, yield, and reliability (DFM/DFY/DFR)
• Ensure design rule compliance across all deliverables
• Use Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SiP) for design execution

What You Bring

• Bachelor's or Master's degree in Electrical/Electronics Engineering
• Mid-level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design
• Strong hands-on experience in Siemens Xpedition (XPD) or Cadence Allegro/APD (SiP)
• Proven experience in substrate design, SI/PI-aware implementation, and design rule compliance

What We Offer

• Engagement with a leading semiconductor engineering firm
• Opportunity to work on cutting-edge IC packaging projects
• Flexible location options: Chandler, AZ or Hillsboro, OR

About us:

Tessolve Semiconductors, a venture of Hero Electronix, is a Design and Test Engineering Service Company providing End to End Solutions from Product Engineering, Software, Hardware, Wireless, Automotive and Embedded Solutions. Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, spec to the product. With 2500+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose. Tessolve offers a highly competitive compensation and benefits along with an electric work environment to scale one’s intellect, skills and growth.