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Yield Engineer On Shift

$85.2k - $139.81k

Intel Corporation

Role Overview Join Intel's Advanced Packaging Team as part of the Substrate Packaging Technology Development (SPTD) organization. The Yield Engineer On Shift (YEOS) provides critical factory support by addressing equipment, process, and product issues in real time to enable uninterrupted 24x7 lot movement through the manufacturing line. Key Responsibilities Receive written and verbal pass-down from tool owners and previous shift peers. Execute shift‑priority tasks and escalate issues via the calling tree when roadblocks arise. Tool troubleshooting, recipe modifications, PIL reviews and approvals, and execution of non‑standard procedures (e.g., visual inspections, engineering scans, basic analysis). Write and update specifications and RFCs after reviews with tool owners and internal stakeholders, including defect reduction teams. Provide thorough written and verbal pass-down to the incoming shift, ensuring clear, structured communication of activities, issues, and observations. Behavioral Traits Strong problem‑solving and troubleshooting skills. Effective verbal and written communication skills. Willingness to collaborate closely with peers, engineers, and customers. Flexibility to support night and weekend shifts over extended periods. Ability to learn quickly and handle new tasks efficiently. Capability to work with minimal supervision and adapt to rapidly changing priorities. Self‑driven mindset with the ability to manage individual responsibilities while contributing to team objectives. Strong documentation skills, including careful analysis of observations and well‑reasoned conclusions. Qualifications Minimum: Bachelor’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 1+ years of relevant experience. OR Master’s degree in one of the above fields. Experience with defect metrology or yield tool sustenance, RFC setup, and SPC. Preferred Qualifications 1+ years of experience in semiconductor packaging or substrate manufacturing. Prior experience working night and weekend shifts. Job Type & Shift Experienced hire; Shift 8 (United States of America). Location United States, Arizona, Phoenix. EEO Statement & Position of Trust All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military, and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust: N/A. Salary Annual Salary Range: $85,200.00 – $139,810.00 USD. Work Model This role requires on‑site presence. Additional Information Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during the hiring process. #J-18808-Ljbffr Intel Corporation

Vacancy posted 18 hours ago
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