Technical Project Manager, Embedded Hardware

Seeking an Engineering Service candidate with strong project management skills, efficient communication, and an engineering background to help our team decompose and manage test station development and bring up. Ideal candidate will have 4-7 years of Project Management experience in consumer electronics.

Responsibilities:

• Drive Test Engineering teams to identify their hardware and software development and validation dependencies; develop schedules for test solutions (Fixture, software, validation) delivery, track delivery of dependencies and top-level product; highlight risks and elevate gaps.
• Decompose test and calibration requirements into discrete features with specific dependencies, track deliverables against system milestones.
• Schedule meetings between cross functional teams to discuss issues as required; Capture meeting notes and action items and follow up at checkpoints.
• Document and share learnings of build bring up timelines and deliverables between CM partners.
• Collaborate with TE internal logistics teams and cross functional EPM teams to coordinate logistics; collect hardware module and test Fixture delivery schedules and assess potential bring up/validation risks.
• Apply Project Management methodologies (e.g. critical path analysis, Gantt charting, risk registry) and tools (e.g. JIRA, Confluence, Wrike) to define a repeatable Build Bring up tracking process.

Requirements:

• 4-7 years of Project Management experience in consumer electronics
• Ability to design and implement PM processes, decomposing objectives into discrete deliverables, and applying proper framework to track and manage progress.
• Experience defining, collecting, and tracking system-level, hardware, and software requirements; history of working with cross functional partners.
• Robust understanding of hardware NPI, xVT build cadences, and the role of factory test as it relates to System builds.
• Track record of taking proactive steps to uncover, highlight, and bridge risks.
• Clear and efficient English language communication, verbal and written.
• Willingness to collaborate with remote teams during China-friendly hours.
• EE background highly preferred

Bonus:

• Experience working with OEMs, expertise in test engineering for embedded products.

Duration: 12+ months (Ongoing)