Remote Lead: Substrate Layout for Multi-Die Packages

Piper Companies is seeking a Senior Substrate Layout Designer to lead the design of advanced multi-die substrate packages. The role is onsite 5 days a week in Saratoga, CA or remote to align with Pacific coast time hours. Responsibilities include end-to-end layout, bump map optimization, routing strategies, and collaboration with ASIC, SI, and power teams to ensure manufacturability. Requires 6–8+ years in substrate layout and a BSEE.