Senior Memory Subsystem Architect - HBM for AI/ML
$146k - $309kMicron Technology Inc
Micron Technology in Folsom, California is looking for an experienced candidate to design and develop next‑generation HBM DRAM products. The ideal candidate will have a Bachelor’s or Master’s degree in Electrical or Computer Engineering and a minimum of 10 years of experience in memory subsystem architecture. Responsibilities include developing memory subsystem architectures for AI/ML solutions, collaborating with partners, and leading performance simulations. A competitive salary of $146,000.00 to $309,000.00 annually is offered. #J-18808-Ljbffr Micron Technology
Vacancy posted 4 days ago
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