Process Validation Engineer

SMT Process Experiment EngineerPurpose of the position Foxconn Technology Group, a globally leading electronics manufacturing company, is now hiring a SMT Process Experiment Engineer. Lead failure mode experiment analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as Cross-section/Dye & pry / Thrust & Pull/ Torsion etc. Experimental anomaly analysis SMT process defects, such as void, crack, cold solder using optical microscopy, data support for process optimization and collaborate with DFM teams to improve designs based on failure mode data. Develop test methodologies for new materials (low temperature solders, Flex PCBs)Duties and ResponsibilitiesLead SMT failure mode experiment analysis: such as Cross-section, Dye &pry, Thrust-pullTorsion etc.Preparation SMT failure mode experiment analysis reportMaintenance experimental equipmentManage and training operation techniciansOptimize failure mode experiment analysis processes and methods to improve efficiency and accuracySupport Line-qualification of SMT lines and progress trackingEducation and work experienceEducational Requirements: Bachelor's degree or above The best major in electronics,mechanical enigerring, chemistry and physics.Work Experience (Nice-to-Have): Preference is given to those with relevant work experience, and outstanding recent graduates are also eligible to apply.Working conditionsJoin a high-growth, innovation-driven team shaping next-gen consumer electronics.Work at the intersection of engineering, automation, and global operations.Be part of a diverse, bilingual team with strong cross-Pacific collaboration.Typically 8–5 core hours with flexibility, though project deadlines may require occasional overtime.Modern, collaborative offices or labs with flexible setups emphasizing innovation and teamwork.Skills:The process is familiar with the experimental method and stepFamiliarity with SMT process flow is preferred.