Packaging Process Engineer

About NY Creates NY Creates serves as a bridge for advanced electronics, leads projects that advance R&D in emerging technologies, and generates the jobs of tomorrow. NY Creates also runs some of the most advanced facilities in the world, boasts more than 3,000 industry experts and faculty, and manages public and private investments of more than $25 billion—placing it at the global epicenter of high‑tech innovation and commercialization. Job Description Position Summary, Packaging Process Engineer NY Creates is looking for a Packaging Process Engineer to work with our AIM Photonics team that will be hands‑on working with advanced solder interconnect equipment and materials for the assembly of optoelectronic packages. AIM Photonics is one of nine U.S. DoD Manufacturing Innovation Institutes which are industry‑driven, public‑private partnerships that focus the nation's premier capabilities and expertise to capture critical global manufacturing leadership. Key Responsibilities Develop wire bonding and interconnect processes and build heterogeneously integrated electronic and optoelectronic packages using state‑of‑the‑art equipment at TAP. Run DOE experiments to find the best machine parameters to achieve successful builds of advanced packages. Such processes include flip‑chip, solder attach, plasma cleaning, thermal compression bonding, additive printing, and dispensing. Evaluate and qualify materials including solders used in electronic and optoelectronic packages as required by customers' application. Work with high precision equipment to build parts with good solder interconnect integrity and reliability. Perform continuous inspection, characterization, and metrology of a process to make sure process is robust. Serve as liaison with marketing, vendors, purchasing, and customer on technical information. Interpret failure analysis reports and cross‑sections to understand solder joint integrity. Gather and analyze data; conduct root cause and failure mode analysis to efficiently improve yields and device performance. Other duties as assigned. Requirements Minimum Qualifications, Packaging Process Engineer Bachelor's degree in mechanical engineering, material science, engineering physics, or equivalent AND 3+ years of experience in fabrication, packaging, or manufacturing of semiconductor devices. Experience with wire bonding or fiber attach for photonics assembly. This position is contingent on the satisfactory completion of a background check. Preferred Qualifications, Packaging Process Engineer 5+ years' experience with hands‑on wire bonding or active alignment fiber attach. Strong understanding of engineering and materials science fundamentals and a demonstrated aptitude to learn. Experience in cleanroom, high precision equipment, inspection, and characterization equipment in semiconductor assembly line. Experience in back‑end assembly process including flip‑chip bumping, thermal compression bonding, and solder reflow highly desired. Experience with flux and fluxless soldering of eutectic solder alloys and intermetallic formation. Experience with failure analysis of solder joints. Strict discipline to follow rules, specifications, have good attention to detail as well as good organization skills. DOE experience is a plus. Excellent oral and written communication skills. This position may require annual background checks. Don't meet every requirement? At NY Creates we are dedicated to building a welcoming team. If you are excited about working for NY Creates but your experience doesn't exactly align perfectly with the job description, we encourage you to apply anyway—you might still be a perfect fit for this or another role. Benefits Medical, Vision, and Dental Competitive Pay and PTO Flexible Health Spending and Dependent Care Accounts Basic / Optional Life Insurance Post‑Retirement Health Insurance Employer contribution of 7% of earnings to a Basic Retirement plan after meeting one year of service. Optional employee contributed retirement account Location Rochester, NY Salary Range $70,000 – $140,000 (posted salary rates are determined upon experience and education) Additional Information NOTE: Some positions require access to export‑controlled commodities, technical data, technology, software, or restricted programs where U.S. Government authorization may be required. For positions requiring such access, offers of employment are contingent upon the employer being able to obtain the necessary authorization, including, if required, an export license from the U.S. Department of Commerce's Bureau of Industry and Security, the U.S. Department of State's Directorate of Defense Trade Controls, or other government agencies. The decision to pursue an export license application is at The Research Foundation for SUNY's sole discretion. Proof of status may be required prior to employment in connection with necessary authorizations. Employment is with the Research Foundation for SUNY. The Research Foundation is an Equal Opportunity Employer, including individuals with disabilities and protected veterans. In compliance with the Americans with Disabilities Act (ADA), if you have a disability and require a reasonable accommodation to apply please call Human Resources at View phone number on click.appcast.io. #J-18808-Ljbffr Vance Airscoop