Senior Program Manager / Chief of Staff, Enablement (Semiconductor Engineering)
Rapidus Corporation US
We are seeking a highly experienced and strategically minded Senior Program Manager to lead complex, cross‑functional initiatives within the Enablement organization of our 2nm and subsequent advanced‑node (e.g., 1.4nm) semiconductor foundry . This role requires deep familiarity with advanced‑node development, strong technical intuition, and the ability to influence across engineering, manufacturing, ecosystem partners, and executive stakeholders. Approximately 30% of this role includes Chief of Staff–level responsibilities , acting as a trusted advisor and operational partner to the Head of Enablement. You will help shape organizational priorities, drive execution excellence, and ensure alignment across global teams in the U.S. and Japan. This position is based in Albany, NY . About Rapidus Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world‑class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting‑edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry. Why Join Us You will play a central leadership role in building the world’s most advanced 2nm and next‑generation enablement ecosystem , shaping the foundation for future semiconductor innovation. Key Responsibilities Own and drive high‑impact, multi‑quarter programs across PDK/ADK development, design enablement infrastructure, modeling, and R&D shuttle readiness for 2nm and future nodes such as 1.4nm. Define program strategy, execution frameworks, and governance models for complex cross‑team deliverables. Anticipate technical and organizational risks early; drive mitigation plans and executive‑level escalations. Lead alignment across Enablement, Process Integration, DTCO, Design Services, EDA vendors, IP partners, and customer engineering teams. Ensure ecosystem readiness for current and next‑generation nodes, including design flows, collateral, models, and customer onboarding. Guide teams through ambiguity, establishing structure, clarity, and accountability across diverse stakeholders. Represent Enablement in executive reviews, customer engagements, and cross‑company steering committees. Chief of Staff Responsibilities (≈30%) Act as a strategic partner to the Head of Enablement, helping define organizational priorities, operating rhythms, and long‑range planning. Build and maintain dashboards that track organizational KPIs, OKRs, roadmap health, and operational performance. Prepare executive‑level materials for quarterly reviews, strategic planning, and cross‑company alignment. Drive operational excellence across the organization, including process improvements, communication frameworks, and decision‑making workflows. Support headcount strategy, hiring, onboarding, and talent development initiatives. Serve as a proxy for the Head of Enablement in leadership forums and cross‑functional decision‑making. Strengthen collaboration across global teams, including U.S.–Japan coordination. Required Qualifications Bachelor’s or Master’s degree in Engineering, Physics, Computer Science, or a related technical field. 10+ years of program management or technical leadership experience in semiconductors, EDA, design enablement, or advanced manufacturing. Proven track record leading complex, multi‑disciplinary programs at advanced nodes (5nm, 3nm, 2nm or beyond are preferred). Strong understanding of semiconductor development workflows (PDK/ADK, design flows, modeling, verification, packaging, or DTCO). Demonstrated ability to influence senior technical leaders and executives. Exceptional communication skills, including the ability to synthesize technical content for executive audiences. Experience building scalable program structures, governance models, and operational processes. Preferred Experience with R&D shuttle programs, early customer enablement, or ecosystem readiness for next‑generation nodes. Knowledge or hands‑on experience with high‑speed and high‑bandwidth IP, such as PCIe, HBM, SerDes, or similar interface/memory IPs. Background working with EDA vendors, IP partners, OSATs, or advanced packaging R&D centers. Experience leading cross‑regional teams, especially U.S.–Japan collaboration. Japanese proficiency is a plus. PMP, Agile, or similar certification. Personal Attributes Strategic thinker with strong execution discipline. Highly proactive, structured, and comfortable driving clarity in ambiguous environments. Strong interpersonal influence; able to build trust across engineering, operations, and executive teams. Operates with a mindset of continuous improvement and organizational scaling. Comprehensive Health, Dental and Vision coverage, fully at company's expense (no deductibles) #J-18808-Ljbffr Rapidus Corporation US
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