Field Process Engineer - High Volume Manufacturing/Field Applications

Why   Oxford Instruments?

Our purpose is to accelerate the breakthroughs that create a brighter future for our world. Our technology and scientific expertise enable our customers to discover and bring to market exciting new advances that drive human progress. We aim to be the scientific instrumentation partner in every significant lab and production facility across the world. Our people and culture are vital to our success. We strive to offer the opportunities that will attract, engage, motivate and develop the very best talent. This involves creating an inclusive environment and culture where difference is valued and people are recognised for what they deliver and bring to the team.

We want to empower our employees so that they innovate, support our growth and improve our productivity. We support them to make the right decisions and reach their full potential as they develop their careers at OI. Our ways of working are lived every day and are as follows:

• We start with the customer
• We succeed by being focused
• We make and keep our promises
• We work together as one team
• We help and trust each other to succeed

Applicants must be authorized to work for ANY employer in the US. We are unable to sponsor or take over sponsorship of employment Visa at this time.

Location: Texas (Houston or DFW)

Reports To: Field Process Service Manager

Travel: Up to 50% | FLSA: Exempt

Position Summary

Oxford Instruments is seeking a Process Engineer – High Volume Manufacturing (HVM) / Field Applications to support advanced plasma processing systems across semiconductor manufacturing environments. This role blends field service expertise with process engineering ownership, supporting tool performance, customer acceptance, yield optimization, and uptime in 24/7 high-volume manufacturing (HVM) operations. This role is ideal for experienced engineers—particularly those from or with experience with - Lam Research, Applied Materials, or Tokyo Electron (TEL)—who bring strong tool knowledge and want to expand into process optimization, troubleshooting leadership, and customer-facing engineering. The position requires hands-on engagement with plasma etch/deposition systems, vacuum systems, chamber maintenance, wet cleans, contamination control, and process recovery within a fast-paced manufacturing environment.

Key Responsibilities
Process Performance, Acceptance & Sustaining

• Lead tool validation, qualification, and customer acceptance activities
• Verify system performance against specifications
• Optimize plasma processes for yield and throughput• Support production ramp into HVM
• Develop process recipes as needed from existing starting points
Process & Equipment Support
• Support daily fab operations
• Monitor chamber and tool performance
• Analyze trends and implement fixes

Key Technical Activities
• Plasma chamber mfg quals & cleans as needed• Vacuum, RF, electrical & PLC control troubleshooting
• Process qualification excursion engineering
• Particle mitigation

Required Qualifications • Bachelor’s degree in STEM field
• 3–8+ years experience
• Plasma tool (dep or etch) experience
• PLC control circuits troubleshooting skills
• Vacuum and RF knowledge

Preferred Qualifications • Lam/Applied/TEL experience
• ICP/RIE/ALD/PECVD/ICPCVD
• HVM experience
• Contamination control
• Thin film metrology

KPIs • Tool uptime
• Yield improvement
• SPC stability
• MTTR, MTBC
• Customer satisfaction

Work Environment • Cleanroom PPE
• Physically active
• Travel up to 50%

Compensation

In occordance with Massachusetts law he expected salary for this  full-time, benefited  position is between $100,000 - $120,000 . The actual compensation will be determined considering factors such as relevant skills and experience and other factors permitted by law. 

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