Package Layout Architect (2.5D/3D) — Equity
DensityAI, Inc.
DensityAI, Inc. is seeking an experienced package layout engineer to own substrate and interposer layout end-to-end in Mountain View, CA. You will drive 2.5D/3D packaging, co-design with architecture, and coordinate with OSATs to release designs from bump map to tapeout. You should have 8+ years in high-performance package layout, hands-on with Cadence Allegro and Xpedition tool flows, and a track record of delivering complex interposer-based layouts. Visa sponsorship available. #J-18808-Ljbffr DensityAI, Inc.
Vacancy posted 3 days ago
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