Packaging Systems Architect: Multi-Physics for Data Center
Advanced Micro Devices , Inc.
Advanced Micro Devices (AMD) in Austin, TX seeks a Package-centric Mechanical Modeling Architect to define and drive next-generation packaging-platform architectures. You will develop, validate, and apply mechanical and multi-physics models guiding architecture across package, board, and cooling solutions for data center and HPC systems. The role requires ownership of modeling rigor, collaboration across silicon, package, board, and manufacturing teams, and influence on product roadmaps with a #J-18808-Ljbffr Advanced Micro Devices , Inc.
Vacancy posted 2 days ago
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