Senior Process Engineer

Senior Thin Films Process EngineerNXP's Austin Technology and Manufacturing Center (ATMC) has an immediate opening for a Senior Thin Films Process Engineer. ATMC is NXP's most advanced internal 200mm high volume manufacturing wafer fab, producing Automotive and Industrial products with our 90nm - 250nm Copper and Aluminum Process Technologies. The position requires ownership and responsibility for process control, process development, and optimization of semiconductor processes and equipment. This role plays a critical part in ensuring high levels of product quality, yield and process stability in a high-volume manufacturing environment. The ATMC Films Process Engineering group is responsible for all PVD, CVD and RTA processes within the factory.Key ChallengesDevelop and optimize processes for silicon semiconductors.Implement and maintain SPC (Statistical Process Control) and FDC (Fault Detection and Classification) systems.Analyze metrology data to monitor material quality and drive improvements.Reduce defectivity mechanisms and improve process control.Participate in and/or lead cross-functional teams to exceed factory and functional area level Safety, Quality, Delivery and Cost goals.Solve complex process and integration problems utilizing electrical, chemical and physical analysis techniques.Lead troubleshooting and root cause analysis (8D/3x5WHY/Fishbone) for process deviations and yield issues.Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities.Drive equipment performance to maximize capacity and yield performance.Improve cost performance of processes, equipment and production flows.Demonstrate Technical Leadership through mentoring engineers and technicians to further develop the team.Job QualificationsEducation: B.S., Masters or Ph.D degrees in Chemical, Materials Science, Mechanical or Electrical Engineering.Job Experience: Greater than 10 years working in the Semiconductor Industry, within a High Volume Manufacturing wafer fab. Less is acceptable with advanced degrees (Masters/Ph.D).Direct experience owning PVD, CVD or RTA processes.Hands-on experiences with Applied Materials 5500 Endura PVD, Applied Materials 5200 Centura CVD/RTA, Applied Materials Producer CVD or Novellus HDP CVD systems.Experience with install, start-up, qualification and release to production of PVD, CVD or RTA tools.Experience with supporting or leading New Product Introduction / New Technology Introduction Factory Level Projects.Experience using DOEs to optimize and improve either existing or new processes.Positive interpersonal skills, highly energetic and self-motivated.Excellent verbal and written communication skills.Statistical Analysis skills: Six Sigma Green Belt or Black Belt preferred.NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.