AI Packaging Engineer - Next-Gen Trainium Systems
Annapurna Labs
Annapurna Labs (U.S.) Inc. in Tempe, AZ is seeking a Package Technology Engineer to drive next-generation trainium packaging efforts. You will work across architecture, materials, and manufacturing to ensure reliable, cost-efficient solutions for advanced AI accelerators. The role collaborates with OSATs, suppliers, and internal teams to validate capabilities, perform risk analysis, and guide qualification from concept to volume production. #J-18808-Ljbffr Annapurna Labs
Vacancy posted 2 days ago
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