Sr Architect, Technical Product Manager (3DIC Packaging)

General InformationJob TitleSr Architect, Technical Product Manager (3DIC Packaging)Job ID18502CityAustinState/ProvinceTexasDate Posted27-Aug-2026Job CategoryProduct ManagementJob SubcategoryTechnical Product ManagementHire TypeEmployeeRemote EligibleYesBase Salary Range: $195000 - $292000Descriptions & RequirementsJob Description and RequirementsWe AreSynopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with customers across industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.You AreYou are a senior technical product leader with hands-on experience in IC packaging design, package analysis, and production tapeout flows. You have worked directly with multi-die and package layout tools, and SI/PI, thermal and mechanical analysis flows.You understand 2.5/3DIC, chiplet, HBM, photonics, and co-packaged optics architectures and can engage credibly with architects, silicon and package engineering teams, foundries, OSATs, and ecosystem partners.This Technical Product Management role requires substantial engineering depth. Success depends on understanding the technology, design flows, and implementation challenges well enough to guide roadmap priorities, define detailed requirements, and validate solutions against real packaging problems.What You’ll Be DoingDevelop the technical roadmap for multi-die advanced package design, implementation, and signoff analysis.Engage with customers, foundries, and OSATs to translatepackaging challenges into prioritizedrequirements.Evaluate the competitive landscape, emerging technologies, and evolving design methodologies to guide roadmap priorities and position Synopsys offerings with technical clarity.Work hands-on with engineering teams to define capabilities, evaluate technical tradeoffs, andvalidatesolutions across silicon, advanced package, and package substrate flows.Drive cross-functional delivery of solutions addressing package implementation, SI/PI,multiphysics,and manufacturing challenges.Advance AI-driven and agentic workflows for multi-die design,multiphysicsanalysis, and optimization.Present the technical product vision and roadmap to executives, customers, and ecosystem partners, and represent Synopsys at industry events andstandardsengagements.Provide technical direction tofield teams supporting customer evaluations and deployments.The Impact You Will HaveEnable next-generation AI accelerators, high-performance computing, and data-center silicon built on advanced multi-die architectures.Expand Synopsys’multi-diepackaging presence through differentiated package design,multiphysicsanalysis, and production solutions.Drive adoption across semiconductor companies,hyperscalers,and design service providers by aligning product capabilities with productiontapeoutrequirements.Strengthen foundryand OSATpartnerships through technical roadmap alignment and co-development.Enable customers to scale multi-die advanced packages by addressing complex implementation, SI/PI, thermal, mechanical, and system integration challenges.What You’ll Need10+ years of semiconductor IC and packaging experience.Deep technical knowledge of ICand packagedesign, analysis, manufacturing, and productiontapeout.Hands-onexpertisewith industry-standardsilicon and packagedesign tools, SI/PI analysis tools, and related production flows.Expertisein signal integrity, power integrity, EMIR, thermal, and mechanical analysis for advanced packages.Experience with2.5D/3DIC,chiplet, HBM, photonics, and co-packaged optics architectures&methodologies.Familiarity with high-speed interfaces such as PCIe, DDR, and HBM in the context of packagedesign & signoff.Understanding ofAI-driven and agentic workflows for design automation,analysis, and optimization.Experience working with semiconductor companies,hyperscalers, foundries, OSATs, and ecosystem partners.Demonstrated ability to translate complex technical challenges intorequirements and roadmap priorities.At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability.In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.