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Postdoc: Metrology for Advanced Semiconductor Packaging

Johns Hopkins University

Johns Hopkins University in Gaithersburg seeks a PREP Research Associate to advance metrology for semiconductor packaging within the NIST PREP program. The role involves designing test methods, building rigs, and performing bond-strength tests across temperature ranges, collaborating with materials characterization teams. A PhD in a related field and experience with wafer bonding and FEM tools are required; US citizenship preferred, compensation $70,000–$89,000. #J-18808-Ljbffr Johns Hopkins University

Vacancy posted 1 day ago
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