Career Accelerator Program - Packaging Engineer

Change the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must! Packaging engineers play an important role at TI which encompasses the following responsibilities:Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readinessParticipate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverageDirect design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs. As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy. Put your talent to work with us as a Packaging engineer !Why TI?Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TIBenefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits hereAbout Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.Minimum Requirements:Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or relatedCumulative 3.0/4.0 GPA or higherPreferred Qualifications:Basic understanding of statistical process control (SPC)Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)Demonstrated analytical and problem solving skillsStrong written and verbal communication skillsAbility to work in teams and collaborate effectively with people in different functionsStrong time management skills that enable on-time project deliveryAbility to build strong, influential relationshipsAbility to work effectively in a fast-paced and rapidly changing environmentAbility to take the initiative and drive for resultsTexas Instruments will not sponsor job applicants for visas or work authorization for this position.Full timePosting Date: 2026-09-11