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Principal TPM - AI Chip Silicon Tape-Out Lead

Jobleads-US

Amazon Inc. through Annapurna Labs is seeking a Principal Technical Program Manager to own end-to-end program execution for a multi-die ML accelerator chip.

You will connect engineering workstreams into a coherent schedule, identify critical paths, and drive cross-functional decisions to keep the program on track across RTL, DV, physical design, packaging, and infrastructure domains. You will lead weekly status cadences, manage external design partners, and drive infrastructure readiness for

#J-18808-Ljbffr Jobleads-US
Vacancy posted 3 days ago
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