Director PCB CAD

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Services Group, Engineering Services Group > PWB Design

General Summary:

Location: onsite San Diego

Job Overview

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

Role / Skills / Exp

The successful candidate will lead a world class design team across multiple project disciplines and be responsible for PCB / PWB designs for Qualcomm centralized hardware design teams. Manage workflow across geo’s successfully looking for ways to streamline engagements across BUs. Directs teams to manage complex data, conducts high quality advanced analyses and verify accuracy for large projects. Needs to actively lead discussions with critical stakeholders from other functional engineering disciplines to align project deliverables and actual milestones.

Leadership skills with expectations for leading designs from concept thru production. Also to provide project leadership for scoping requirements, lead times, schedules, and to ensure successful completion of quality board layouts.

Leads efforts in developing new, innovative processes and implementing improvements to existing approaches to maximize efficiencies across functional areas. Reviews others' ideas and encourages them to gain support for translating ideas into solutions and procedures. Holds regular meetings with team leads to achieve goals.

Lead efforts to further drive innovative tool automation across the CAD and QCAE support teams and hold regular meetings with cross functional team members.

Is a CAD tools expert in Mentor Xpedition, Mentor PADS and / or Cadence Allegro PWB design software and is expected to have multiple years of experience in developing PWB design solutions for a variety of design types and working with internal teams and external suppliers to support PWB fabrication and assembly.

Overseas the mentoring and development of the entire CAD design team across multiple tools and holding regular sync meetings with team members for strategy download.

The candidate is expected to have hands on experience on RF, Digital and High Speed designs. Leads a design department and supervises other designers and serves as a mentor and subject matter expert across multiple types of complex designs and stack ups as well as for tools and processes while also driving process improvements globally across design cross functional teams.

Defines & guides PCB stack up and via structures, works with PCB fabrication vendors to define same. Implements all required design constraints for mechanical and electrical performance as well as CCA assembly. Conducts design rule verification at each stage and performs basic signal integrity tests. Verifies system signal integrity, power integrity, manufacturability. Diagnoses and troubleshoots technical issues with the designs, tools and processes. Works to create and drive efficiencies, automations, and optimizations.

Minimum Qualifications

• 12+ Years of PCB / PWB team management
• 15+ years actively involved in PCB / PWB design for high-density electronics packaging.
• 15+ years experience in a PCB / PWB design role designing reference designs utilizing latest generation processor chips.
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

Preferred Qualifications

• Bachelor's degree in Electrical Engineering, Computer Science, Mathematics, or related field.
• 16+ years of RF, Mixed Signal, High Speed Digital, and Power PCB design or related experience.
• 16+ years of hands-on experience with Allegro, PADS, or Expedition layout tool.
• 6+ years in a leadership role with direct reports.
• 4+ years’ experience managing global reports and delegating work with a global design team.
• 4+ years of work experience in a role requiring interaction with senior leadership (e.g., Vice President level and above).
• Hands on experience with RF and Mixed Signal technologies, Complex vias structures and stack ups, Very high pin count components, High layer count PCBS, High speed digital interfaces such as MIPI, SERDES, QLINK, DDR5x PCIE, GB ethernet etc, high power PCBs.
• Solid understanding of IPC specifications and overall industry specifications for complex system circuit board designs, standards and specifications.
• 4+ years of working with operating budgets and/or project financials.
• Depth knowledge of PCB stack-up and its impact on Signal/Power Integrity
• Depth knowledge of DFM/DFA and its impact on Fab/Assembly
• 8+ years Experience with Valor checks for DFM
• Experience with signal and power return strategies
• Interact with fab houses / buyers for new technologies / design challenges
• Has led tool automation efforts across the PCB / PWB space.
• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.
• Expected to possess expert understanding and demonstrated application of PWB design principles, practices, and standards.
• Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.
• Develops solutions to a variety of complex problems and proposes PCB / PWB design trade-offs to the engineering design team for resolution and implementation.
• Determine PCB / PWB design trade-offs necessary to meet design requirements and produce high quality cost effective PCB’s / PWB’s that meet schedule objectives.
• Understands the requirements and helps drive PCB / PWB technology and process trends and their application to Qualcomm designs.
• Maintain technical coordination with Engineering and Manufacturing. Resolve PCB / PWB design issues with fabrication and assembly vendors.
• Leads and initiates process improvement, PWB and DFM checklists and guidelines.
• Leads assignment and plans, schedules and activities in accomplishing objectives.
• Experience with IDF/EMN file exchange between mechanical and HW teams.
• Understands project goals and individual contribution toward those goals.
• Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
• Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.
• Effectively multitasks and meets aggressive schedules in a dynamic environment.
• Prepare and deliver design reviews to project team.
• Possess excellent verbal and written communication skills

Education Requirements

Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field

Minimum Qualifications:

Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field and 15+ years of PCB layout handling or related work experience.ORHigh School diploma or equivalent and 17+ years of PCB layout handling or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail View email address on click.appcast.io or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$170,600.00 - $256,000.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.