Field Service Engineer

Field Service Engineer – Semiconductor Equipment (300 mm / High-Pressure Anneal)

Location: Arizona, United States

Employment Type: Full-time

Travel: Approximately 30%

HPSP is a leading manufacturer of semiconductor capital equipment. We design and support high-pressure annealing systems used in advanced semiconductor manufacturing. We are seeking a hands-on Field Service Engineer to install, maintain, troubleshoot, and improve the reliability of 300 mm high-pressure annealing furnace systems at customer facilities.

This is a customer-facing role for an engineer or experienced technician who enjoys solving complex electromechanical problems, working safely in a fab environment, and building trusted relationships with customers and internal technical teams.

What You’ll Do

• Install, commission, test, and support HPSP semiconductor equipment at customer sites.
• Perform scheduled preventive maintenance, corrective maintenance, troubleshooting, repair, and recovery activities on complex 300 mm high-pressure annealing systems.
• Diagnose issues across electrical, electronic, mechanical, pneumatic, vacuum, heating, gas-delivery, factory-automation, wafer-transfer, and safety-interlock subsystems.
• Use schematics, technical documentation, logs, test equipment, and structured troubleshooting methods to identify root causes and restore tool operation.
• Complete timely, accurate field-service reports, maintenance records, technical reports, and documentation required for system reliability tracking and customer billing.
• Communicate equipment status, technical findings, risks, and recovery plans clearly to customers, site leadership, and HPSP support teams.
• Support equipment installations, upgrades, qualifications, and customer acceptance activities.
• Provide technical guidance and training to customers and other field-service personnel as appropriate.
• Capture recurring issues, documentation gaps, and improvement opportunities; provide feedback to engineering, product-quality, and service teams.
• Travel on short notice when needed to support customers and fellow field-service engineers.

Work Schedule

This position is based at a customer manufacturing facility and normally follows a Monday–Friday day-shift schedule. Compressed workweeks, occasional overtime, and off-hours support may be required to meet customer and equipment needs.

Minimum Qualifications

• Associate degree or technical certification in electronics, electromechanical technology, mechatronics, automation, or a related discipline; equivalent relevant experience will be considered.
• Hands-on troubleshooting experience with complex electrical, mechanical, pneumatic, vacuum, robotic, automation, or process equipment.
• Ability to read and apply electrical schematics, mechanical drawings, technical procedures, and equipment documentation.
• Strong diagnostic, analytical, and problem-solving skills.
• Comfortable using standard hand tools and electrical/electronic test equipment.
• Clear written and verbal communication skills and a professional, customer-focused approach.
• Ability to work effectively both independently and as part of a cross-functional service team.
• Strong ownership, integrity, attention to detail, and commitment to safe work practices.
• Ability to travel approximately 30%.

Preferred Qualifications

• Field-service, maintenance, installation, or sustaining-engineering experience in semiconductor manufacturing or another high-technology industrial environment.
• Experience supporting 300 mm semiconductor equipment, batch furnaces, thermal systems, vacuum systems, gas-delivery systems, robotics, or factory automation.
• Experience with high-pressure systems, high-temperature furnaces, wafer handling, PLC-controlled equipment, or semiconductor safety practices.
• Familiarity with customer-fab work environments and documentation requirements.

Join HPSP and help deliver reliable, responsive support for advanced semiconductor manufacturing equipment while building deep technical expertise in high-pressure annealing technology.