Electrical Manufacturing Engineer

Anduril Industries is a defense technology company with a mission to transform U.S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to the defense industry, Anduril is changing how military systems are designed, built and sold. Anduril’s family of systems is powered by Lattice OS, an AI-powered operating system that turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years. Anduril’s Manufacturing Engineering team is responsible for rapidly iterating, scaling, and sustaining cutting-edge defense hardware, including autonomous flight vehicles, intelligent ground systems, radar, and sensor payloads. We bridge the gap between complex electrical architecture and physical hardware production. As an Electrical Manufacturing Engineer , you will serve as the technical authority for Circuit Card Assemblies (CCA/PCBA), embedded electronics manufacturing, and production test definition across both New Product Introduction (NPI) and rate production. You will embed with hardware design teams to drive rigorous Electrical DFM/DFA/DFT , define manufacturing test coverage and strategies to guide dedicated test engineering teams, lead embedded hardware bring-up on the line, and partner with world-class Electronics Manufacturing Services (EMS) suppliers to achieve high-yield, mission-critical reliability. If you are a hands‑on electrical problem‑solver who understands hardware at the silicon, board, and systems level—and wants to build scalable manufacturing processes for next‑generation defense systems—this role is for you. WHAT YOU'LL DO PCBA Design for Manufacturability & Assembly (DFM / DFA): Partner directly with Electrical Hardware Design Engineers during schematic capture and layout to optimize complex multilayer rigid and rigid‑flex boards for automated SMT production. Review board layouts in Altium Designer, Cadence Allegro, or Mentor Graphics to verify pad geometries, solder mask dams, trace clearances, via‑in‑pad plating, and component spacing to maximize assembly yields. Review component footprint, connector section, and active IC packages to ensure manufacturability and functionality with production processes. Production Test Strategy & Process Definition: Ensure the manufacturing test strategy across board and sub‑assembly levels are executable. In‑Circuit Testing (ICT bed‑of‑nails), flying probe, boundary scan (JTAG), and connectorized functional verification tests (FVT). Establish test limits, pass/fail criteria, and fault‑coverage metrics to hand off to the Manufacturing Test Engineering team. Design for Testability (DFT): Partner with Electrical Design Engineers during schematic capture and layout to drive strict DFT guidelines—ensuring adequate test point density, probe access, net observability, and connector accessibility required for production test fixtures. Test Sequence & Process Integration: Define standard test processes, routing sequences, and flashing/calibration workflows for the factory floor. Work closely with the Manufacturing Test Engineering team to ensure their automated test fixtures, instrumentation racks, and software suites integrate seamlessly into production line routings and MES data tracking. Test Failure Disposition & Testability Feedback: Analyze production test yield fallout and telemetry to identify whether failures stem from component defects, SMT process variation, or test fixture/coverage escapes, feeding actionable data back into the test and design loops. Embedded Hardware Bring‑Up, Firmware, & Automation: Develop and utilize diagnostic scripts in Python and Bash to exercise board interfaces, log diagnostic telemetry, and support hardware verification during initial manufacturing bring‑up. Support initial board bring‑up on the manufacturing line across modern embedded compute platforms, such as AMD/Xilinx Zynq UltraScale+ SoCs, ARM Cortex processors, and high‑speed memory interfaces. Define production flashing, secure‑key provisioning, and interface validation procedures over embedded buses and protocols: MIL‑STD‑1553, PCIe, Ethernet, CAN, SPI, I2C, UART, and JTAG. Collaborate with Embedded Software, FPGA, and Test Engineering teams to specify low‑level test hooks, firmware images (C/C++), or register‑level diagnostic routines needed to validate hardware health. Enforce high‑reliability aerospace workmanship standards across internal integration lines and external EMS suppliers in accordance with IPC‑A‑610 and IPC/WHMA‑J‑STD‑001 (Class 3 criteria). Lead electrical failure analysis (FA) and root‑cause investigations (8D) on production fallouts: evaluate microsections, X‑ray (AXI) inspections, solder bridging, component counterfeit screening, and ESD damage down to the component level. Support environmental stress screening (ESS), including manufacturing screening strategies aligned with MIL‑STD‑810 (vibration/shock/thermal), MIL‑STD‑461 (EMI/EMC), and MIL‑STD‑704 (power quality) guidelines. EMS Partner Management & Production Line Integration: Qualify and audit external PCBA contract manufacturers (EMS), reviewing SMT stencil designs, solder paste inspection (SPI), automated optical inspection (AOI), reflow thermal profiles, and conformal coating/potting applications. Transition Engineering BOMs (eBOMs) into production‑ready Manufacturing BOMs (mBOMs) within PLM (Teamcenter), ensuring electrical alternate components are qualified and traceable. Author clear standard operating procedures (SOPs) and work instructions for electronics handling, ESD control, wire harness interconnects, and module‑level box builds. REQUIRED QUALIFICATIONS B.S. in Electrical Engineering, Computer Engineering, or equivalent engineering field. 3+ years of experience in an electrical manufacturing, PCBA industrialization, or hardware engineering role with heavy exposure to board‑level manufacturing and integration (aerospace, defense, automotive, medical, or telecommunications). Proficiency with ECAD tools: Experience navigating, reviewing, and redlining schematics and layouts in Altium Designer, Cadence Allegro, or Mentor Graphics/PADS. Hands‑on PCBA production experience: Deep understanding of SMT manufacturing, component placement, reflow profiling, wave/selective soldering, and DFM principles for rigid and rigid‑flex boards. Test process & DFT background: Demonstrated experience defining test coverage, test point guidelines, and manufacturing test strategies (ICT bed‑of‑nails, functional verification, boundary scan) to inform dedicated test engineering teams. Scripting & automation skills: Proficiency with Python or Bash for automated hardware interaction, instrument control, or test log parsing. Embedded protocols: Hands‑on experience debugging, flashing, or testing over standard interfaces: CAN, Ethernet, I2C, SPI, UART, and JTAG. Working knowledge of IPC‑A‑610 and IPC J‑STD‑001 electronic assembly standards. U.S. Person status is required as this position needs to access export‑controlled data. PREFERRED QUALIFICATIONS 5+ years of experience taking complex electronic systems from NPI through full‑rate production. Experience with AMD/Xilinx Zynq UltraScale+, FPGA architectures, or high‑speed digital designs (PCIe, multi‑gigabit Ethernet). Familiarity with military and aerospace compliance standards, including MIL‑STD‑461 (EMI/EMC), MIL‑STD‑810, MIL‑STD‑704, and DO‑254 hardware development life cycles. Experience with complex board architectures: multilayer high‑speed digital boards (12+ layers), rigid‑flex circuits, HDI, and blind/buried microvias. Experience utilizing Siemens Teamcenter (PLM), modern ERP/MES platforms, and Jira for engineering workflow tracking. IPC‑A‑610 / J‑STD‑001 Application Specialist (CIS) or Trainer (CIT) certification. US Salary Range $126,000 - $167,000 USD The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full‑time offers; and are considered part of Anduril's total compensation package. Additionally, Anduril offers top‑tier benefits for full‑time employees, including: At Anduril, we invest in our people. Our comprehensive, competitive benefits package (available at little to no cost to employees) ensures you’re supported in health, recovery, and whatever comes next. For more information, Explore Our Benefits . As set forth in Anduril Industries’s Equal Employment Opportunity policy,we do not discriminate on the basis of any protected group status under any applicable law. If you believe you belong to any of the categories of protected veterans listed below, please indicate by making the appropriate selection. As a government contractor subject to the Vietnam Era Veterans Readjustment Assistance Act (VEVRAA), we request this information in order to measure the effectiveness of the outreach and positive recruitment efforts we undertake pursuant to VEVRAA. Classification of protected categories is as follows: A "disabled veteran" is one of the following: a veteran of the U.S. military, ground, naval or air service who is entitled to compensation (or who but for the receipt of military retired pay would be entitled to compensation) under laws administered by the Secretary of Veterans Affairs; or a person who was discharged or released from active duty because of a service‑connected disability. A "recently separated veteran" means any veteran during the three‑year period beginning on the date of such veteran's discharge or release from active duty in the U.S. military, ground, naval, or air service. An "active duty wartime or campaign badge veteran" means a veteran who served on active duty in the U.S. military, ground, naval or air service during a war, or in a campaign or expedition for which a campaign badge has been authorized under the laws administered by the Department of Defense. An "Armed forces service medal veteran" means a veteran who, while serving on active duty in the U.S. military, ground, naval or air service, participated in a United States military operation for which an Armed Forces service medal was awarded pursuant to Executive Order 12985. Voluntary Self‑Identification For government reporting purposes, we ask candidates to respond to the below self‑identification survey.Completion of the form is entirely voluntary. Whatever your decision, it will not be considered in the hiringprocess or thereafter. Any information that you do provide will be recorded and maintained in aconfidential file. Voluntary Self‑Identification of Disability Form CC-305 Page 1 of 1 OMB Control Number 1250-0005 Expires 07/31/2029 A disability is a condition that substantially limits one or more of your “major life activities.” If you have or have ever had such a condition, you are a person with a disability. Disabilities include, but are not limited to: Alcohol or other substance use disorder (not currently using drugs illegally) Autoimmune disorder, for example, lupus, fibromyalgia, rheumatoid arthritis, HIV/AIDS Blind or low vision Cancer (past or present) Cardiovascular or heart disease Celiac disease Cerebral palsy Deaf or serious difficulty hearing Diabetes Disfigurement, for example, disfigurement caused by burns, wounds, accidents, or congenital disorders Epilepsy or other seizure disorder Gastrointestinal disorders, for example, Crohn's Disease, irritable bowel syndrome Intellectual or developmental disability Mental health conditions, for example, depression, bipolar disorder, anxiety disorder, schizophrenia, PTSD Missing limbs or partially missing limbs Mobility impairment, benefiting from the use of a wheelchair, scooter, walker, leg brace(s) and/or other supports Nervous system condition, for example, migraine headaches, Parkinson’s disease, multiple sclerosis (MS) Neurodivergence, for example, attention‑deficit/hyperactivity disorder (ADHD), autism spectrum disorder, dyslexia, dyspraxia, other learning disabilities Partial or complete paralysis (any cause) Pulmonary or respiratory conditions, for example, tuberculosis, asthma, emphysema Short stature (dwarfism) Traumatic brain injury PUBLIC BURDEN STATEMENT: According to the Paperwork Reduction Act of 1995 no persons are required to respond to a collection of information unless such collection displays a valid OMB control number. This survey should take about 5 minutes to complete. #J-18808-Ljbffr