Onsite Micro Assembler B: Die/Wire Bonding Expert
Power Device Corp
Power Device Corporation in Bohemia, NY is seeking a Micro Assembler B to perform moderately complex assembly operations with increased independence. The role involves die bonding, wire bonding, header assembly, and reading complex drawings to produce high-reliability components for aerospace, defense, and space applications. Responsibilities include mentoring junior teammates, conducting regular quality checks, meeting production goals, and communicating issues to supervisors. #J-18808-Ljbffr Power Device Corp
Vacancy posted 4 days ago
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