Thermal Engineer at Qualcomm Santa Clara, CA

Thermal Engineer job at Qualcomm. Santa Clara, CA. Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Systems Engineering General Summary Qualcomm Data Center team is developing high performance, energy efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork‑oriented individuals for our cutting‑edge technology work. Position: Thermal Engineer As an experienced Thermal Engineer (individual contributor), you will work closely with the platform team developing high‑performance servers, collaborating with cross‑functional teams, including packaging, electrical, mechanical, and component suppliers. You will be responsible for conducting thermal simulations, testing, and characterization to validate and improve thermal models and solutions for high‑performance computing systems. Key Responsibilities Perform die/package/system‑level thermal modeling to analyze and optimize server package and system thermals. Support thermal design of packages and systems from concept through detailed design and manufacturing readiness. Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements. Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness. Research thermal management materials and solutions for advanced electronics. Develop and maintain documentation, guidelines, and tools to support design processes and project success. Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers. Minimum Qualifications Master's degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field. 5+ years of hands‑on experience in thermal modeling within the high‑tech industry. Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation. Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak). Understanding of electronics cooling technologies (passive and active). Knowledge of packaging technologies, server design, and thermal management materials. Proven ability to work independently and collaboratively within a cross‑functional team environment. Strong technical documentation skills and excellent written and verbal communication. Preferred Qualifications Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field. 10+ years of hands‑on experience in thermal modeling within the high‑tech industry. Understanding of OCP product designs and industry best practices. Engineering design and industry experience with high‑end servers. Expertise in conducting CFD simulations with thermal modeling tools (e.g., Celsius EC, Flotherm, Icepak). Proficiency with thermal testing (e.g., DAQ, LabVIEW, thermocouples, airflow measurements, thermal chambers) for computer hardware. Proficiency in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development. Experience with CAD tools (e.g., SolidWorks, Creo). Pay Range $220,200.00 - $330,400.00 Benefits In addition to the above pay, Qualcomm offers a competitive annual discretionary bonus program and opportunity for annual RSU grants. Employees also receive a highly competitive benefits package designed to support your success at work, at home, and at play. EEO Employer Qualcomm is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. #J-18808-Ljbffr Itlearn360