Advanced Packaging Process Integration Engineer (Chiplets)
$100k - $160kThintronics®
Thintronics® in California is seeking a Process Integration Engineer to optimize materials in semiconductor production flows. This role involves collaborating with substrate manufacturers and requires about 25-30% travel to Asia for customer support and technical reviews. The ideal candidate has 5+ years of experience, a degree in Chemical Engineering or related field, and skills in chiplet integration. Competitive salary $100,000–$160,000 with opportunities for growth and a comprehensive benefits package are offered. #J-18808-Ljbffr Thintronics®
Vacancy posted 3 days ago
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