SOC Timing Analysis (STA) Engineer ,HBM

You will be part of the Heterogeneous Integration Group (HIG), owning chip-level static timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, design for test (DFT), verification, and product teams to ensure timing integrity from initial design through tape-out. This is a hands‑on senior technical role focused on chip-level static timing analysis ownership, timing closure, methodology development, and pre‑ and post‑silicon timing correlation. Responsibilities Own end-to-end chip-level static timing analysis and sign-off and all timing checks including setup, hold, recovery, removal, and data-to-data across all process corners, operating modes, and voltage and temperature conditions. Develop, maintain, and validate comprehensive Synopsys Design Constraints (SDC) for all clock domains, reset trees, high‑bandwidth memory (HBM) physical interfaces, Joint Test Action Group (JTAG), memory built‑in self‑test (MBIST), design for test (DFT), and configuration logic, ensuring sign‑off quality and reuse across design generations. Drive timing closure at block, subsystem, and full‑chip levels through critical path analysis, timing engineering change orders (ECOs), and close collaboration with physical design teams on placement, clock tree synthesis (CTS), and routing to meet timing targets. Perform multi‑mode, multi‑corner (MMMC) timing analysis including setup and hold closure, clock domain crossing (CDC) timing, and application of on‑chip variation derates (OCV, AOCV, POCV) appropriate for advanced technology nodes. Lead signal integrity and crosstalk analysis, identify noise‑induced timing violations, and work with physical design teams to implement mitigation strategies, while conducting DFT timing analysis including scan chain timing, automatic test pattern generation (ATPG) mode constraints, MBIST timing closure, and JTAG interface timing. Partner with RTL and architecture teams to provide early static timing analysis feedback on micro‑architectural decisions, clock architecture, timing budgets, and power and area tradeoffs, and develop and maintain automation scripts and flows in Python and Tcl for constraint generation, timing report extraction, waiver management, quality of results dashboards, regression tracking, and sign‑off readiness reporting. Perform post‑silicon timing correlation by analyzing silicon measurement data against pre‑silicon predictions, identifying systematic discrepancies, feeding learnings back into timing models, tool settings, and methodology updates, and engaging directly with electronic design automation tool vendors to evaluate new features, resolve tool issues, and drive methodology enhancements. Define and drive organization‑wide static timing analysis methodology, sign‑off standards, and timing closure best practices; lead readiness reviews and tape‑out sign‑off gates; mentor and grow junior engineers; contribute to design documentation, timing sign‑off reports, constraint specifications, and block‑level timing budgets; and collaborate cross‑functionally with Physical Design, RTL Design, Verification, DFT, Product Engineering, and Test teams to ensure timing requirements are met through all phases of the design cycle. Minimum Qualifications 10+ years of industry experience in chip‑level static timing analysis with a proven track record of full timing sign‑off ownership on multiple tape‑outs at 5 nanometers or below. Deep, hands‑on expertise with industry‑standard static timing analysis tools such as Synopsys PrimeTime and/or Cadence Tempus, including configuration of analysis modes, corner libraries, and sign‑off decks. Expert‑level understanding of advanced timing concepts including multi‑mode multi‑corner analysis, on‑chip variation techniques, signal integrity and crosstalk analysis, and power‑aware timing in sub‑5‑nanometer technology nodes. Proven ability to develop and own complex SDC timing constraints for large hierarchical system‑on‑chip designs with multiple clock domains, asynchronous interfaces, and mixed‑voltage power domains. Experience across the full RTL‑to‑GDS implementation flow including synthesis, placement, clock tree synthesis, routing, physical sign‑off, hierarchical static timing analysis methodologies, and timing‑driven collaboration with physical design engineers. Preferred Qualifications Exposure to design‑for‑test (DFT) concepts including scan, memory built‑in self‑test, built‑in redundancy analysis and repair, and debug. Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. Familiarity with foundry process design kits, Liberty timing models, ECSM and CCS noise models, and advanced process variation modeling. Excellent analytical and debug skills with the ability to trace timing failures to root cause across RTL, constraints, physical implementation, and tool methodology. Strong communication skills with the ability to present timing status, risks, and sign‑off readiness clearly to cross‑functional teams. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology, Inc.