Principal Thin Films Engineer, Advanced Packaging
1000 Micron Technology, Inc.
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development (APTD) team leads the creation of groundbreaking memory and storage solutions that power the AI era. We work hand‑on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production‑ready technologies. Position Overview We are seeking an experienced Process Engineer with expertise in depositing thin films who will thrive in a fast‑paced and results‑oriented environment. The goal is to employ robust solutions to thin‑film challenges that meet the detailed physical and electrical requirements for Micron’s industry‑leading memory products. Job Responsibilities Develop, optimize and characterize thin‑film processes to meet the requirements of pioneering advanced packaging products. Collaborate with process integration and other process development teams to develop innovative solutions. Optimize deposition processes to reduce cost, process variability, GHG emissions and improve process capability. Conduct root‑cause and failure‑mode analysis to understand limitations of current hardware and engage vendors for solutions. Maintain a technology development pilot manufacturing line. Support process transfer to production facilities (including minimal travel). Minimum Qualifications MS or PhD in Materials Science, Chemical Engineering, Chemistry, Physics or other related technical fields. 7+ years of industry experience in Advanced Packaging with specialization in thin‑film deposition and characterization. Understanding of growth and characterization of thin films. Proficiency with data analysis, DOE and statistical techniques. Knowledge of thermodynamics, chemical kinetics and their direct application to film deposition. Strong analytical and creative problem‑solving skills paired with extensive technical knowledge to guide decisions and strategies for projects. Preferred Qualifications Experience with plasma processing and its impact on film properties. Experience in programming/scripting/automation and creation or regular use of AI agents. Benefits Comprehensive medical, dental and vision plans at all locations. Income protection programs for work‑related illness or injury. Paid family leave. Robust paid time‑off program and paid holidays. Equal Opportunity Statement Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr 1000 Micron Technology, Inc.
- ...inspiring the world to learn, communicate and advance faster than ever.Department Overview:The Advanced Packaging Technology Development (APTD) team at... ...We are seeking an experienced Process Engineer with expertise in depositing thin films who will thrive in a fast paced and...PrincipalLocal areaImmediate start
- 1000 Micron Technology, Inc. is seeking an experienced Process Engineer in Boise, Idaho to develop and optimize thin-film processes for advanced packaging products. Candidates should have over 7 years of industry experience and a strong background in materials science or...Suggested
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- ...is seeking a Process Development Engineer to focus on dielectric deposition for advanced DRAM devices. This role involves driving... ...decisions, improving key film metrics, and collaborating with cross... ...relevant experience or a PhD, hands-on thin-film deposition experience, and...
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...Micron Technology, Inc. is seeking a Thin Films Process Development Engineer located in Boise, Idaho. In this role, you will develop deposition processes for next-generation DRAM technology, focusing on EUV patterning films. Ideal candidates should hold a PhD or MS with...Remote work- ...technology firm in Boise, Idaho, is seeking a candidate to optimize thin film processes in semiconductor fabrication. This role involves... ...ideal applicant will hold a Bachelor's degree in a relevant engineering or science field and have experience with statistical process...
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- ...Technology, Inc is seeking a Senior Product Engineer in Boise, Idaho, to drive innovation in... ...with experience in semiconductor packaging processes. The role involves collaboration... ...decisions that influence technological advancements. Preferred qualifications include...
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- Req ID: JR95525 Principal Engineer Advanced Package Technology Development Job Summary As a Principal Engineer within Micron’s Advanced Package Technology Development team, you will play a key role in driving innovation through strategic, industry‑informed leadership. Based...PrincipalLocal areaRelocation
- ...transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer within Micron’s Advanced Package Technology Development team, you will play a key role in driving innovation through strategic...PrincipalLocal area
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