Senior Director, Chiplet Packaging & FCBGA Innovation
Semiengineering
Amkor in Tempe, AZ is seeking a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies for AI, computing, networking, and PCs.
You will interface with Tier 1 customers and Amkor’s R&D center in Korea to drive roadmaps and successful commercialization. You’ll lead cross-functional teams through concept to production ramp while guiding technology directions, performance targets, and reliability goals.
#J-18808-LjbffrVacancy posted 3 days ago
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