Manufacturing Coordinator

is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~16,800 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more 

Our culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

We are seeking a detail-oriented and motivated individual to join our Die Fab department in the Separation area. This team plays a critical role in supporting both internal and external customers by manufacturing high-quality circuits on 3-inch and 200mm wafers. As a Separation Operator, you will be responsible for the precise separation and cleaning of both production and prototype circuits. You’ll work closely with engineering teams, area trainers, and fellow operators to support Die Fab’s mission and production goals. While collaboration is key, this role also requires a high level of independence and accountability.

Though you will be part of a team, you will be working independently to contribute to the area’s goals. The scope and complexity of your work will be based on your current capabilities and your ability to gain new skills. The separation position requires the ability to handle delicate products as instructed by the product documentation and engineering specifications through the entire separation process. Die Fab wafers must be mounted on special tape and layered with special chemicals prior to separation with extremely thin precision diamond blades or laser separation technology. Operators are required to use standardized procedures to complete all tasks in the area.

· Perform delicate handling and processing of wafers according to detailed product documentation and engineering specifications.

· Mount wafers on specialized tape and apply chemical layers in preparation for separation.

· Operate precision equipment including ultra-thin diamond blade cutters and laser separation systems.

· Follow standardized procedures and strict safety protocols to ensure consistent quality and reliability.

· Contribute to continuous improvement by learning new skills and adapting to evolving processes.

· Able to work in an ESD environment and follow all ESD protocols

· Strong attention to detail and manual dexterity for handling fragile components.

· Ability to work independently while maintaining alignment with team objectives.

· Willingness to learn and grow within a high-tech manufacturing environment.

· Experience in cleanroom or semiconductor manufacturing is a plus.

· Experience with Microsoft applications.

· Strong verbal and written communication skills.

· Able to work in a cross-functional environment collaboratively with other departments

Pay Range:

USD $56,090.00 - USD $93,480.00 Year

***Keysight is an Equal Opportunity Employer.***