HBM PDFA Engineer: AI-Driven Yield & Failure Analysis

Micron USA Inc

Micron Technology in Boise, Idaho seeks an HBM Product Yield Enhancement PDFA Engineer to drive next‑gen HBM devices from design to mass production. You will apply electrical/physical characterization, data analysis, and AI‑driven insights to identify failure mechanisms and coordinate improvements across cross‑functional teams.

Ideal candidates have 5+ years in electrical and statistical failure analysis, strong experience with characterization techniques, and a Bachelor’s degree in

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Vacancy posted 14 hours ago

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