Mechanical Engineer II

Mechanical Engineer II

SUMMARY

Firefly Avionics Mechanical Engineers will leverage their creative design and experience to develop electronics enclosures, mechanical components, integration hardware, tooling, and test fixtures for launch vehicles. Qualified candidates will be responsible for design, analysis, hands‑on build/integration, and support of environmental testing. You will be part of the avionics team and will work closely and collaborate with all other teams across the company.

RESPONSIBILITIES

Design ruggedized electronics packaging and structural components for PCB assemblies used for launch vehicle and spacecraft applications Design electro‑mechanical assemblies for thermal and dynamic environments, EMI/EMC compatibility, and radiation resistance Perform thermal analyses (steady state thermal and thermal cycling) of electronics in aerospace environments Perform modal and vibration analyses of electronic assemblies with mechanical/structural components In addition to electronics packaging, candidate will be responsible for design of test fixturing and ground support hardware for launch vehicle and spacecraft electronics Support vibration, shock, and thermal test campaigns of products designed Candidate will be responsible for development of CAD designs, part drawings, assembly drawings, and technical documentation including presentations and reports Work with the PCB design team to specify mounting strategies, mechanical keep outs, hole size and spacing, PCB copper weights, connector type and placement, and thermal interfaces to the PCB assembly

QUALIFICATIONS

Required Bachelor of Science in mechanical engineering, aerospace engineering, or related field 3+ years of engineering experience designing electronics packaging and electro‑mechanical assemblies via internships, professional industry experience, or academia 3+ years of 3D CAD design and drafting experience Desired Hands on experience with design and integration of electronics packaging Proficiency with NX or similar CAD software and analysis tools such as ANSYS Experience with multi-layer PCBA enclosure design Experience with various design features and calculations for mechanical packaging of electronics including vent analyses, EMI/EMC mitigation strategies, multi‑component tolerance stack‑up calculations, bolt load calculations, Steinberg PCB solder joint fatigue, etc. Understanding of basic subsystems of a launch vehicle and how avionics integrate within the vehicle and interface with instrumentation Experience designing for CNC machining and sheet metal production, as well as selecting appropriate materials and finishing processes #J-18808-Ljbffr Cedarparktexasedc