Director of Advanced IC Packaging Development

Renesas is seeking a Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency.

Responsibilities

• Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies.
• Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) .
• Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand.
• Establish and maintain corporate package design rules to ensure manufacturability and reliability

1. Technology Roadmap & R&D Strategy

• Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies.
• Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) .
• Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand.
• Establish and maintain corporate package design rules to ensure manufacturability and reliability

2. Global OSAT & Supply Chain Management

• Benchmark, select, and qualify global OSATs and Contract Manufacturers (CM) for new package technologies.
• Drive DOE (Design of Experiments) with partners to optimize assembly processes and establish rigorous process specifications.
• Monitor production early in the ramp phase to resolve integration issues and ensure superior quality.

3. NPI, Qualification & Quality Control

• Lead the transition of new products from R&D to High Volume Manufacturing (HVM).
• Collaborate with Product and Reliability teams to qualify new packages within aggressive timeframes.
• Resolve process integration bottlenecks by ensuring exhaustive window checks on critical process steps.
• Implement SPC (Statistical Process Control) and production monitors to prevent quality incidents and excursions.

4. Cross-Functional Leadership

• Act as the technical authority for internal and external customer complaints, working with Marketing, Quality, and Operations to provide root-cause analysis and resolutions.
• Maintain a competitive edge by staying current on industry innovations in interconnect methods (Wire-bonding, Multi-chip modules, etc.).

• Education: Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.
• Experience: 15 to 20 years of relevant experience in semiconductor package development, specifically emphasizing power SIP/modules andwafer level & flip-chip packaging.
• Deep knowledge of Power SiP/Modules , Flip-Chip , and Wafer Level assembly.
• Familiarity with Smart Power Stages and Vertical Power architectures.
• Expertise in SPC , statistical analysis software, and qualification methods.
• Exceptional interpersonal, presentation, analytical and communication skills

The expected annual pay range for this position is $200K - $250K. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.

Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.