AI Server/Rack Thermal Engineer

Company Overview:

Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 233 campuses across 24 countries. In the US, Foxconn employs 8,000 across 56 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas, and California. As of 2025, Foxconn ranks 28 th among the Fortune Global 500 and reported revenue of approximately USD $259 billion.

The company’s diverse product offerings span four major segments: smart consumer electronics, cloud, and networking solutions, computing, and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together, these initiatives position the company as a leader in innovation for the 21st century. 

Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious production methods. 

Job Summary:

The primary purpose of the AI Server / Rack Thermal Engineer (focused on L10/L11 execution) is to own the thermal profile validation, cooling efficiency optimization, and fluid-dynamics performance testing of integrated AI rack systems on the factory floor. This role ensures that fully assembled, high-density AI clusters operate within safe temperature parameters and that advanced liquid-cooling hardware—such as Coolant Distribution Units (CDUs), dripless quick-disconnect valves, and direct-to-chip water blocks—functions flawlessly under peak compute loads before shipping to the customer.

Duties and Responsibilities:

• Validate liquid cooling performance for AI server and rack systems by monitoring and analyzing coolant flow, temperature, pressure, and other key telemetry data to ensure cooling loops and related components operate within engineering specifications. Identify performance abnormalities and collaborate with engineering teams to optimize cooling efficiency, system stability, and reliability.
• Conduct thermal profiling and burn-in testing under high-compute and high-power workloads to evaluate AI server and rack thermal performance. Analyze temperature, power, airflow, coolant, and component-level data to verify that critical hardware remains within defined thermal limits and identify potential performance or reliability issues.
• Investigate thermal failures, overheating events, abnormal temperature conditions, and component hotspots using system telemetry, test results, and engineering analysis. Determine root causes and implement corrective actions to improve cooling performance, mitigate thermal risks, and prevent recurring issues.
• Calibrate and optimize cooling-control parameters, including fan-speed curves, pump controls, temperature thresholds, and sensor responses, based on system workload and environmental conditions. Partner with firmware and hardware engineering teams to achieve effective thermal management while balancing cooling performance, system stability, and power efficiency.
• Manage and document thermal-related engineering changes, defects, test findings, root causes, and corrective actions throughout product development and validation. Coordinate with R&D, NPI, manufacturing, quality, and other engineering teams to ensure thermal issues are properly tracked, resolved, validated, and incorporated into product or process improvements. 

Education:

• Bachelor of Science (BS) Degree in Mechanical Engineering (with a heavy, verified specialization in thermodynamics, fluid mechanics, and heat transfer) or Aerospace Engineering (focusing on thermal sciences and fluid dynamics) or Thermal / Energy Engineering. 

Experience:

• 2+ years of Liquid Cooling & Fluid Dynamics Testing
• 2+ years of Full-System Thermal Validation & Hardware Stress Testing
• 1+ year of Thermal Failure Analysis (FA) & Diagnostic Instrumentation
• 1+ year of BMC / BIOS System Telemetry & Control Tuning 

EEOC Statement

Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.