Senior Thin-Film Architect, Advanced Packaging
Jobleads-US
Micron Technology, Inc. in Boise, Idaho is seeking a Principal Thin Films Engineer for Advanced Packaging. You will lead development and optimization of thin film deposition processes for next-generation memory products, taking ideas from concept through pilot to production.
The role requires deep SME in thin films and 7+ years in Advanced Packaging, with data analysis/DOE and collaboration across process integration, failure analysis, yield, and equipment vendors. Some travel may be required.
#J-18808-Ljbffr Jobleads-USVacancy posted 2 days ago
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