Field Service Technician

Job Description

Job Description

Job Summary

The Field Service Engineer will provide Level II technical support for semiconductor manufacturing equipment in a cleanroom environment. This position is responsible for tool qualification, equipment recovery, preventive and corrective maintenance, material handling, alarm response, troubleshooting, post-maintenance recovery, and documentation. The engineer will support production operations while following all applicable Intel safety, quality, and operational standards.

Key Responsibilities

• Perform preventive maintenance, corrective maintenance, equipment recovery, and tool qualification activities on diffusion equipment.
• Complete equipment start-up and shutdown procedures, leak checks, inspections, calibrations, component replacements, cleaning, and recovery activities.
• Respond to equipment alarms, troubleshoot technical issues, and support return-to-production efforts.
• Conduct wafer and material handling activities in accordance with established cleanroom protocols.
• Complete work orders, maintenance documentation, checklists, and shift handoff reports accurately and on time.
• Follow all Intel safety requirements, including personal protective equipment, Control of Hazardous Energy and lockout/tagout procedures, and chemical and electrical safety standards.
• Escalate safety, quality, or equipment concerns and maintain production-ready conditions within the assigned work area.
• Complete all required tool-specific, safety, and operational training before performing tasks independently.

Qualifications

• Three to five years of experience supporting semiconductor manufacturing equipment.
• Experience supporting diffusion and thermal processing equipment from manufacturers such as ASM, TEL (Tokyo Electron), Applied Materials, Kokusai, or equivalent semiconductor processing platforms.
• Experience with diffusion equipment, troubleshooting, preventive maintenance, and corrective maintenance.
• Knowledge of semiconductor cleanroom practices, wafer handling, and equipment safety procedures.
• Strong problem-solving, documentation, and communication skills.

Work Environment

• Semiconductor cleanroom environment
• Required use of appropriate PPE
• Work may be scheduled across approved shifts based on production and operational needs

Shift : Multiple positions open for different shifts:

• Day Shift: 7:30 AM - 8:00 PM
• Night Shift: 7:30 PM - 8:00 AM
• Lead: Swing Shift: 5:00 AM - 4:30 PM

manufacturing and design

Company Description

manufacturing and design